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  • 1
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    Journal of applied electrochemistry 30 (2000), S. 193-200 
    ISSN: 1572-8838
    Keywords: copper ; copper oxide ; gadolinium-doped cerium oxide ; nitrogen oxide ; oxygen
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract The electrochemical reduction of NO and O2 on a Cu-point electrode covered with a surface layer of CuO is investigated in an electrochemical cell with a gadolinium doped cerium oxide oxygen ion conducting electrolyte in the temperature interval 300–500 ∘C. It is shown that the reduction of NO on CuO is possible at a lower overvoltage than it is in the case of the reduction of O2. The results indicate that the reduction of NO on CuO is not inhibited in the presence of O2 and that the reduction of NO can be selectively performed on a CuO-electrode.
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  • 2
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    Journal of applied electrochemistry 30 (2000), S. 831-838 
    ISSN: 1572-8838
    Keywords: anodic linear sweep voltammetry ; cobalt ; copper ; electrodeposition ; vitreous carbon
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract Some aspects of the electrodeposition of copper and cobalt from aqueous sulphate solutions containing low concentrations of their ions were studied with a view to heavy metal removal via an electrochemical process. Both metals were deposited on a vitreous carbon rotating disc electrode. Deposits formed under different conditions were studied employing linear sweep voltammetry, scanning electron microscopy and EDAX surface analysis. Constant potential electrolysis was used to simulate recovery in a laboratory batch reactor. Copper can be deposited without cobalt interference at potentials as cathodic as −1.0 V despite high Co concentrations. At more negative potentials, both metals are deposited simultaneously, although the copper proportion in the binary mixture is greater than that corresponding to the solution concentration ratio. Voltammetry studies effected under conditions in which codeposition occurs show only minor changes in copper behaviour. On the other hand, cobalt behaviour exhibits significant modifications. Even though formation of an intermetallic compound is possible, ASVL and microscopy tests indicate cobalt deposition in different crystalline forms as the more probable cause. In turn, cobalt deposition depends on the polarization conditions of the electrode and on the cobalt and copper concentrations.
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  • 3
    ISSN: 1572-8838
    Keywords: benzotriazole ; corrosion ; copper ; inhibitor ; polyethylene glycol (PEG)
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract Electrochemical methods, including polarization experiments and impedance spectroscopy, were used to evaluate the effectiveness of benzotriazole (BTA) in an aqueous solution of polyethylene glycol (PEG) in protecting polished archaeological copper or archaeological copper covered with corrosion products. The adsorption of PEG on the polished copper significantly limited the corrosion current. The presence of benzotriazole enhanced the protection of the polished copper, giving maximum protection at a concentration of 10−2 mol l−1 of BTA in 20 vol% PEG 400 solution. On the other hand, PEG solutions caused degradation of the corrosion products of the copper. This degradation increased with time. When BTA was added, the corrosion products were preserved and, the higher the BTA concentration, the more the corrosion current decreased. In PEG 400 solution protection of the corrosion products of the copper by BTA improved over time.
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  • 4
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    Journal of applied electrochemistry 30 (2000), S. 1199-1207 
    ISSN: 1572-8838
    Keywords: copper ; electrochemical soil remediation ; limiting current ; soil pH
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract The optimum current for electrodialytic soil remediation occurs when the limiting current of the anion-exchange membrane is exceeded while that for the cation-exchange membrane is not. At this current, an acidic front will pass through the soil from the anion-exchange membrane towards the cathode, and the polluting heavy metals will be mobilized in the acidic environment. At the same time no production of base will occur from the cation-exchange membrane. A basic environment causes precipitation of hydroxides in the soil next to the cation-exchange membrane, and this will give an increase in voltage drop in the system and furthermore hinder the transport of the heavy metals out of the soil. When the acidic front passes through the soil, the voltage drop will decrease, and the end of the remediation can be predicted by the decrease in voltage to a very low level between the working electrodes.
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  • 5
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    Journal of applied electrochemistry 30 (2000), S. 1209-1222 
    ISSN: 1572-8838
    Keywords: chemisorption ; copper ; electrodes ; gold ; 2-mercaptobenzothiazole ; Raman spectroscopy ; silver ; X-ray photoelectron spectroscopy
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract The interaction of the sulfide mineral flotation collector, 2-mercaptobenzothiazole, with silver, copper and gold surfaces has been investigated by surface enhanced Raman scattering (SERS) spectroscopy. 2-mercaptobenzothiazole, the copper, silver and gold compounds of this species, and the dithiolate, 2,2′-dithiobis(benzothiazole) were characterised by 13C NMR and Raman spectroscopy to provide a basis for identifying surface species. SERS investigations showed that, at pH 4.6 where the solution species is in the protonated form, and at 9.2, where it is present as the ion, adsorption on each metal occurs over a wide potential range. Attachment of the organic compound occurs through bonding between the exocyclic sulfur atom and metal atoms in the surface. X-ray photoelectron spectroscopy confirmed that the adsorbed layer was of monolayer thickness. Adsorption of the protonated 2-mercaptobenzothiazole occurs on copper at pH 4.6 at potentials below that at which charge transfer adsorption commences.
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  • 6
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    Journal of applied electrochemistry 30 (2000), S. 379-384 
    ISSN: 1572-8838
    Keywords: benzotriazole ; copper ; corrosion ; mass-transfer coefficient ; rotating-disk electrode
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract The effect of benzotriazole, BTA, on mass transfer in dissolution-corrosion of the copper rotating disk electrode in 0.02 M Fe(III)–0.5 M H2SO4 has been studied by means of atomic absorption spectrometry. The mass transfer coefficient, K, was determined from the slope of ln(C 0/C)Fe(III) vs. time plots. In the absence of BTA the corrosion process can be described by the correlation Sh = KR/D = 4.47Re 0.5. The difference in values between Sh and Sh Levich, and the change in slope in the Arrenhius plot points to mixed control for the cathodic process Fe3+ + 1e− → Fe 2+ and charge transfer control for the anodic process, Cu → Cu2+ + 2e. The average activation energies were 7.7 kJ mol−1 and 19.5 kJ mol−1 at (500–1500) and (2000–3000) rpm, respectively. At low concentration of BTA the inhibiting action of BTA increases with concentration and with rotation speed. For [BTA] ≥ 5 × 10−3 M, the K value, 10−4 cm s−1, remains constant and is independent of rotation rate. The morphology of the copper rotating disk after corrosion in the absence and presence of BTA was examined using scanning electron microscopy (SEM).
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  • 7
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    Journal of applied electrochemistry 30 (2000), S. 617-624 
    ISSN: 1572-8838
    Keywords: adsorbtion isotherm ; benzotriazole ; copper ; corrosion ; finite diffusion impedance ; inhibition
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract The inhibitory action of BTAH on copper was investigated in 1 M sodium acetate solution in the pH range 4–10, using cyclic voltammetry and impedance spectroscopy. Cyclic voltammetry showed that the rearrangement of the surface oxide layer in the presence of BTAH is very fast in slightly alkaline solutions, while it is time- and concentration-dependent in neutral and slightly acidic solutions. The adsorption behaviour of BTAH on the electrode surface at c(BTAH) ≤ 0.5 mM followed a Flory–Huggins adsorption isotherm with ΔG ∘ ranging from −30.0 to −39.0 kJ mol−1, depending on the pH. Impedance spectra were characterized by two time constants relating to the charge transfer and transport of copper ions through the oxide layer, the latter being the rate determining step. These enabled the determination of important properties of the adsorbed layer and the passivated film. The results indicate that the surface layer is of dielectric nature, and its protection increases with increasing inhibitor concentration and solution pH. The finite diffusion impedance was analysed using a diffusion factor B, and the values of the diffusion coefficient and concentration of copper species in the film were estimated.
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  • 8
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    Journal of applied electrochemistry 30 (2000), S. 595-600 
    ISSN: 1572-8838
    Keywords: copper ; corrosion inhibitor ; gliding arc plasma ; humid air plasma ; non-thermal plasma ; sodium hexanoate ; surface cleaning
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract Sodium hexanoate is proposed as corrosion inhibitor for copper when the metal is situated in an aggressive aqueous or gaseous environment. The efficiency of the inhibitor, measured by electrochemical techniques in the ASTM 1384 standard solution, depends on the hexanoate concentration. Copper foils immersed in a (0.1 M) sodium hexanoate conditioning bath, and later exposed to a strongly oxidizing gliding arc plasma in humid air, yield oxide layers, the thickness and the nature of which differ from the unconditioned samples since the voltammograms show no CuO at the surface. The organic salt thus limits the oxidation process induced by the gaseous species. The organic layer remains active for at least 30 min. For longer exposures, the salt begins to degrade to carbon dioxide, which makes the plasma treatment a useful tool to clean metallic surfaces.
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  • 9
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    Journal of applied electrochemistry 30 (2000), S. 737-743 
    ISSN: 1572-8838
    Keywords: copper ; corrosion inhibition ; 3-mercaptopropyltrimethoxysilane
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract 3-mercaptopropyltrimethoxysilane (MPS) has been used as a copper corrosion inhibitor in 0.100 mol L−1 KCl solution. The inhibition was studied as a function of the MPS pretreatment concentration in ethanol. The MPS concentration used was between 1.0 × 10−8 mol L−1 and 1.0 × 10−1 mol L−1. A freshly-cleaned Cu electrode was inserted in an ethanolic solution of MPS for 30 min for pretreatment, and was then exposed to a 0.100 mol L−1 KCl aqueous solution for 1 h. From the polarization resistance, the inhibition efficiency improved with increase in MPS concentration during the pretreatment. The MPS adsorption on Cu followed a Langmuir adsorption behaviour. However, at MPS concentrations larger than 1.0 × 10−4 mol L−1 the inhibition decreased. Moreover, the inhibition efficiency decreased with increase in the exposure time of the MPS modified Cu electrode in the KCl aqueous solution. Polarization studies suggest that MPS is an anodic as well as a cathodic inhibitor, in the presence of dissolved oxygen. X-ray photoelectron spectroscopy (XPS) analysis of the Cu samples showed that the organic compound modifies the Cu surface and scanning electron microscopy (SEM) studies indicated that MPS protects the Cu surface when exposed for 350 h to laboratory environment. Polarized grazing angle Fourier transform-infrared (FTIR) microscopy analysis determined the presence of a polymer on the Cu surface.
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  • 10
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    Journal of applied electrochemistry 30 (2000), S. 959-966 
    ISSN: 1572-8838
    Keywords: copper ; EIS ; inhibition ; pitting ; XPS
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract Electrochemical experiments were performed to study the inhibitive effect towards copper corrosion of three organic compounds: namely, benzotriazole, 1-hydroxybenzotriazole and 3-amino 1,2,4-triazole. Statistical analysis of pit nucleation times showed that 3-amino 1,2,4-triazole exhibited the most significant inhibitive effect towards pitting. However, impedance measurements revealed that this compound produced a thinning of the passive film. This was corroborated by X-ray photoelectron spectroscopy. Results showed that copper pitting resistance could not be explained only by characterizing the protectiveness of the passive film.
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  • 11
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    Journal of applied electrochemistry 29 (1999), S. 1171-1176 
    ISSN: 1572-8838
    Keywords: alloys ; cyclic voltammetry ; electrodeposition ; electroless deposition ; nickel ; phosphorus ; zinc
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract Electroless Ni–Zn–P alloy deposition from a sulphate bath, containing sodium hypophosphite as reducer, was investigated. To increase the plating rate, the deposition parameters were optimized. The effect of process parameters (T, pH and [Zn2+]) on the plating rate and deposit composition was examined and it was found that the presence of zinc in the bath has an inhibitory effect on the alloy deposition. As a consequence, the percentage of zinc in the electroless Ni–Zn–P alloys never reaches high values. Using cyclic voltammetry the electrodeposition mechanism of Ni–Zn–P alloys was investigated. It was observed that the zinc deposition inhibits the nickel discharge and, as a consequence, its catalytic activity on hypophosphite oxidation. It was also found that increase in temperature or pH leads to the deposition of nickel rich alloys.
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  • 12
    ISSN: 1572-8838
    Keywords: alloys ; electroless ; microstructure ; morphology ; nickel ; phosphorus ; zinc
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract Electroless Ni–Zn–P alloy coatings were obtained on an iron substrate from a sulfate bath at various pH values. The effects of changes in bath pH on alloy composition, morphology, microstructure and corrosion resistance were studied. Scanning electron microscopy was performed to observe the morphological change of the deposits with bath pH. Coating crystallinity was investigated by grazing incidence asymmetric Bragg X-ray diffraction and transmission electron microscopy. A transition from an amorphous to polycrystalline structure was observed on increasing the bath alkalinity, and thus decreasing the phosphorus content of the alloys. A single crystalline phase corresponding to face-centred-cubic nickel was identified in the alloys obtained from a strong alkaline solution. An increase in zinc percentage up to 23% in the deposits does not change the f.c.c. nickel crystalline structure. Corrosion potential and polarization resistance measurements indicated that the corrosion resistance of electroless Ni–Zn–P alloys depends strongly on the microstructure and chemical composition. The deposits obtained at pH 9.0–9.5 and with 11.4–12.5% zinc and 11.8–11.2% phosphorous exhibited the best corrosion resistance.
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  • 13
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    Journal of applied electrochemistry 29 (1999), S. 1427-1438 
    ISSN: 1572-8838
    Keywords: anomalous oxidation ; copper ; electrocatalysis ; hydrous oxides ; mediation
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract There is increasing evidence, for example, from recently published surface enhanced Raman spectroscopy data, that copper, silver and gold electrode surfaces in base, may exist in an oxidized state at unusually low potentials. In the present work, which was carried out using electrochemical techniques, up to six oxide reduction peaks were recorded for copper in base in the region below 0.6 V vs RHE. One of these peaks, at about −0.6 V vs RHE, was particularly prominent; this occured at a potential 1.0 V more negative than the standard potential for the Cu/Cu2O electrode reaction in aqueous media. Such behaviour is rationalized in terms of the involvement of nonequilibrium (and hence unstable) active states of the metal surface; these states may be regarded as adatoms or minute clusters (the lowering of the redox potential being due to the unusually low lattice stabilization energy of these active metal atoms). Copper and its oxides, especially Cu2O, are of major interest from a catalytic, electrocatalytic, photocatalytic and microelectronics fabrication viewpoint and the involvement of the active states of the metal, as a key ingredient in several of these areas, is outlined.
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  • 14
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    Journal of applied electrochemistry 29 (1999), S. 393-402 
    ISSN: 1572-8838
    Keywords: copper ; cu–xNi alloys ; EDS ; localized pitting attack ; nickel ; SEM
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract The anodic behaviour of Cu–xNi alloys and Cu and Ni metals was studied in slightly alkaline solutions containing Cl−-ions in the concentration range from 0.01 to 2.0moldm−3. The morphology and composition of the surface films formed by anodic polarization were analysed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). On the basis of quasi-potentiodynamic polarization data, Ec against cNaCl diagrams were constructed, where Ec is the critical pitting potential. These diagrams allow the determination of areas where the materials are susceptible to localized pitting attack. A critical chloride concentration (ccrit) exists below which the resistance to localized corrosion increases with decreasing nickel content and above which it increases with increasing nickel content. This effect is connected with the change in the corrosion resistance observed for the pure metal constituents, i.e., copper and nickel as a function of chloride concentration. The kinetic parameters of pitting corrosion of Cu–xNi alloys reflect the specific properties of both elements and suggest that an increase in Ni content above 40% would not have a significant effect on the corrosion resistance of Cu–xNi alloys.
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  • 15
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    Journal of applied electrochemistry 29 (1999), S. 585-591 
    ISSN: 1572-8838
    Keywords: copper ; electrochemical nucleation ; polycrystalline platinum ; thiourea
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract The influence of thiourea on the nucleation of copper from a 0.30 M CuSO4-1 M H2SO4 solution on polycrystalline platinum electrodes covered by a copper adlayer was investigated. In the case of diffusion controlled nucleation and growth the conditioning potential, that is, the potential of the electrode prior to the application of a large negative potential step, has a strong influence on the nucleation transients. This can result in either a promotion or an inhibition of the nucleation (which is characterized by a change in the nucleation rate constant and/or the site density) depending on the applied potential and the concentration of thiourea. In the region of mixed kinetics and for a fixed value of the conditioning potential (0.175 V vs Cu2+|Cu, that is, in the region of strongest inhibition), a new and rather unexpected effect was observed. Thus, after an induction period, which is proportional to the concentration of thiourea, the current increases sharply to a much higher value, but after reaching a maximum drops again to its original value. At present there is no ready explanation for this phenomenon, which has been called 'nucleation outbursts', but it deserves more investigation because the linearity between the induction time and the concentration of thiourea might have practical applications.
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  • 16
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    Journal of applied electrochemistry 29 (1999), S. 239-244 
    ISSN: 1572-8838
    Keywords: acid solution ; copper ; corrosion potential ; cyanide ; electrodeposition ; zinc diecast
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract The corrosion potential and morphology of copper films deposited from a cyanide solution on zinc diecast were studied in acid solutions similar to those employed in industry for the deposition of a second copper layer. Open circuit potential measurements and gravimetric methods were employed to determine the influence of the copper electrodeposition variables on the corrosion potential. The influence of variables such as the presence or absence of additives, the current density and the copper or cyanide concentrations were studied. The corrosion potential decreased with increasing copper film thickness. Less protection was obtained when a thin copper layer was electrodeposited from a solution without additives. Higher protection for the same thickness was obtained from a solution with high cyanide content. This result is related to the strong interaction between cyanides and the metal surface during the electrodeposition. A smooth surface structure was observed by SEM under these conditions.
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  • 17
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    Journal of applied electrochemistry 28 (1998), S. 971-977 
    ISSN: 1572-8838
    Keywords: plating ; plastic ; copper ; polyimide ; current density ; adhesion
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract To provide protection, electrical conductivity, or a decorative finish, plastic components are often metallized by a three-step process: deposition of a catalytic palladium layer followed by electroless and electrolytic plating. In this paper we focused on determining the relationship between applied current density used to electrodeposit copper and adhesion of the metal to a polyimide substrate. To test a range of current densities on a single sample, we deposited a series of copper strips on a planar sheet of the polyimide material and electrodeposited copper in a modified Hull cell. From peel tests we found that strips subjected to higher current density adhered more strongly to the substrate. This experimental procedure should be generally applicable to other metal-polymer systems.
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  • 18
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    Journal of applied electrochemistry 28 (1998), S. 1351-1357 
    ISSN: 1572-8838
    Keywords: copper ; corrosion ; cyclic voltammetry ; iron ; Spirulina platensis
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract Cyclic voltammograms of iron and copper electrodes were run in sodium hydroxide, carbonate–bicarbonate buffer and culture media for Spirulina platensis at 30°C. Potentiostatic steady state polarisation curves for both electrode surfaces in these electrolytes were performed in the presence and the absence of S. platensis at fixed temperature. Corrosion potential and corrosion current density values of iron and copper were obtained graphically from these curves. In all cases, the largest corrosion current density corresponded to the maximum biogenerated-oxygen concentrations, that is, illuminated culture media containing S. platensis. Corrosion potentials of iron electrodes shifted to positive values for increasing corrosion rates, whereas constant corrosion potentials were obtained for copper electrodes independently of the electrolyte.
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  • 19
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    Journal of applied electrochemistry 28 (1998), S. 963-969 
    ISSN: 1572-8838
    Keywords: copper ; corrosion ; electrochemical noise ; industrial waters ; cyclic voltammetry
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract This paper represents an attempt to apply electrochemical noise analysis to monitor copper corrosion rates in solutions simulating near neutral or acidic industrial waters, containing chloride, sulphate and bicarbonate ions. The very low noise levels characterizing these systems make the evaluation of the noise resistance possible only with a four electrode arrangement, where the electrode couples used to detect the voltage and current fluctuations have different surface areas. This arrangement is probably a handicap to the evaluation of the polarization resistance values from noise resistance data. Cyclic voltammetries were carried out in order to investigate the nature of the corrosion products obtained in solutions with different pH.
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  • 20
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    Journal of applied electrochemistry 28 (1998), S. 411-416 
    ISSN: 1572-8838
    Keywords: anodic dissolution ; copper ; oscillations ; queuing theory
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract Queuing theory is applied to oscillatory phenomena encountered during anodic dissolution, with numerical illustration provided by a laboratory-scale copper dissolution process. The theory interprets oscillation as a two-phase process, where the first phase consists of ion arrival to the electrode and subsequent steps to form a solid deposit on it, and the second phase consists of the deposition process itself followed by partial dissolution of the deposit. The two phases correspond to the process of client-arrival and client-servicing in queuing theory. In particular, the M/M/1, the G/M/1 and the M/M/k queuing models are quantitatively compared in terms of queuing time and certain other queuing characteristics.
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  • 21
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    Journal of applied electrochemistry 28 (1998), S. 503-510 
    ISSN: 1572-8838
    Keywords: copper ; alloy ; copper enrichment ; copper removal
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract The performance of corrosion resistant inorganic oxide coatings formed on Al–Cu–Mg alloys is often degraded by Cu enrichment that occurs during oxide formation. This is particularly true of coating processes conducted in basic solutions. A modification to an alkaline oxide coating process has been made that simultaneously eliminates Cu enrichment and forms a corrosion resistant coating. In this paper, the modified process is described and the resulting coating morphology, structure and composition are reported. Results from electrochemical and exposure corrosion tests show that useful gains in corrosion resistance are achieved. Cu removal during the modified process is rationalized using an argument based on the increase in Cu solubility that occurs in solutions with a pHgreater than the solubility minimum for Cu (9.8), and the effect of Cu complexing by carbonate.
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  • 22
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    Journal of applied electrochemistry 28 (1998), S. 627-635 
    ISSN: 1572-8838
    Keywords: corrosion ; potentiodynamic polarization ; lubricants ; steel ; copper
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract Potentiodynamic polarization has been used to study the corrosion behaviours of mild steel and copper in solutions containing some examples of common types of lubricant additives. A variety of conditions for performing of experiments were investigated. The best results were obtained in a background solution of 0.01m tetra-n-butylammonium perchlorate in 1:1 toluene/ethanol. The behaviour of the aforementioned metals was characterized and compared in solutions containing allyl amine, alkyl phosphite, and organic sulfides. For most solutions, corrosion and pitting potentials and corrosion rates of each metal were found to vary with the compound's concentration. Changes in the corrosivity of chemicals towards metals were monitored as a corrosion inhibitor was added to their solutions. The relative corrosion behaviour observed were consistent with the known performance of these metals in contact with lubricants containing these additives.
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  • 23
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    Journal of applied electrochemistry 28 (1998), S. 1383-1388 
    ISSN: 1572-8838
    Keywords: copper ; corrosion ; oxygen reduction ; sulphide ions
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract The presence of sulphide ions in solution greatly influences the cathodic behaviour of copper in borax solutions (pH9.2), even when this contaminant is in low concentration. Cyclic voltammograms, polarisation curves and Tafel plots are compared for polluted and unpolluted solutions. Prereduced and aged copper electrodes are investigated. The presence of sulphide ions in solution increases the rate of oxygen reduction on copper, thus having a detrimental effect on the global corrosion process. The transformation of the surface film into one with better conductive properties is suggested.
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  • 24
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    Journal of applied electrochemistry 27 (1997), S. 1198-1206 
    ISSN: 1572-8838
    Keywords: alloy ; amorphous ; anomalous ; hydrogen ; iron ; nickel ; phosphorus ; plating
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract In this study we have investigated the electrodeposition of amorphous iron–nickel–phosphorus alloys from a sulfate electrolyte. Fe-Ni alloys are known to exhibit an ’anomalous‘ type of plating behaviour in which deposition of the less noble metal is favoured. We have found that the codeposition of phosphorus from hypophosphite in the electrolyte led to a reversal to a ’normal‘ behaviour. This reversal was due both to the suppression of iron and enhancement of nickel partial currents. The overall deposition process is dominated by the hydrogen evolution reaction. This is exacerbated by the low pH needed to codeposit sufficient phosphorus to achieve an amorphous structure.
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  • 25
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    Journal of superconductivity 5 (1992), S. 33-38 
    ISSN: 1572-9605
    Keywords: Yttrium ; copper ; X-ray ; crystal structure
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Physics
    Notes: Abstract Single crystals of Y2Cu2O5 were obtained in the flux growth process by controlled heating of a mixture of Y2O3, BaO, and CuO in a molar ratio of 1∶8∶20. These crystals were analyzed by a single-crystal X-ray diffraction analysis. The crystal contains polymeric chains of Cu2O5 interspersed by yttrium ions surrounded by octahedral arrangements of oxygen atoms. Crystal data: space group=Pna21,a=10.799(2) Å,b=3.4990(5) Å,c=12.459(2) Å,Z=4, 380 reflections,R=0.026,R w=0.030.
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