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  • Technology  (266,486)
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  • 1
    Electronic Resource
    Electronic Resource
    Step by step development of an electrochemical microanalytical system (1997)
    Springer
    Microsystem technologies 3 (1997), S. 97-101 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  The development of an electrochemical microanalytical system for ionometric measurements (acronym ELMAS) is described. ELMAS combines potentiometric microsensors with solid state ion sensitive membranes, plastic molded and adhesive mounted micropumps, a microchannel system for connecting all components (several sensors, the calibrating solution reservoirs, the micropumps) and microelectronic components for signal processing and system control. The development of any complex technical system requires a good understanding and asks for a specification of high quality. Very useful for this purpose are executable specifications; they can demonstrate system properties already in an early design stage and give a deep insight in the behaviour of the system. Thus the system requirements can be verified and design errors can be detected and eliminated earlier than by other approaches. So we started the development of the ELMAS microsystem with the creation of a dynamical executable specification model, based on Statecharts, performed by the STATEMATE tool. Statecharts are extended finite automata. This model has been combined with a graphical user interface. Running simulations guarantees the correct system behaviour. The graphical interface itself was used for communication between the institutes participating on the development of ELMAS. The next stage of development was characterized by substituting some simulated components by real ones. At this stage microsensors have been combined with macro pumps and conventional electronics. The model running on a workstation controls the sensor and actuator components of macro dimension. The result of this stage was a macro prototype of ELMAS. It was used for testing the new developed microsensors and analysing the system behaviour. Going from the macro to micro components and replacing the workstation by a microcontroller the step by step development of ELMAS ends up in a real microsystem for the simultaneous measurement of pNa and pH. Thus we get a closed chain from specification to realization.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050063
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  • 2
    Electronic Resource
    Electronic Resource
    Tensile testing of microfabricated thin films (1997)
    Springer
    Microsystem technologies 3 (1997), S. 117-121 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Mechanical properties of titanium thin films of 0.5 μm thickness and aluminum thin films of 1.0 μm thickness, microfabricated by magnetron sputtering, were measured by using a novel tensile machine. These thin films are difficult to handle because they are fragile, so the thin film specimens were fabricated by using semiconductor manufacturing technology in a silicon frame to protect them. The test section of these specimens was 300 μm in width and 1400 μm in gauge length. By gripping the thin film specimen with a new device using a micrometer, it could be mounted on the tensile machine easily. The stress-strain diagrams of both thin films were measured continuously in the atmosphere at room temperature. The experimental results indicated that the titanium thin film and the aluminum thin film had a smaller breaking elongation although they had a larger tensile strength than bulk pure titanium and bulk pure aluminum, respectively.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050067
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  • 3
    Electronic Resource
    Electronic Resource
    Novel fast atom beam (FAB) processes for fabricating functional nanostructures on three-dimensional microstructures (1997)
    Springer
    Microsystem technologies 3 (1997), S. 112-116 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  We have developed four manufacturing processes that use a fast atom beam (FAB) for fabricating functional nanostructures on three-dimensional (3-D) microstructures. Such fabrication involves two steps: (1) producing the 3-D microstructure; and (2) producing the nanometer-size functional structures at a local point on this microstructure. The FAB methods that we developed for the first step are the separated (non-contact) mask FAB (SM-FAB) and moving mask FAB (MM-FAB), and those for the second step are the nanometer-motion moving mask FAB (NMM-FAB) and electron-beam deposition-pattern FAB (ED-FAB). We previously demonstrated the capability of the SM-FAB, by producing a multi-faced microstructure, a micro gojyunoto (named after an old Japanese temple tower). In this study, we describe and demonstrate the capability of the MM-FAB, by producing multiple, multi-curved and sloped structure, a diffraction grating structure; the NMM-FAB, by producing ultra-fine stairs, 30 nm wide and 30 nm high; and the ED-FAB, by producing a GaAs line structure, 55.3 nm wide and 13.6 nm high. These results show that these FAB methods are effective in producing 3-D microstructures and nano-structures. Combinations of these methods will make it possible to produce functional nanostructures on 3-D microstructures.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050066
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  • 4
    Electronic Resource
    Electronic Resource
    Fusion bonding of rough surfaces with polishing technique for silicon micromachining (1997)
    Springer
    Microsystem technologies 3 (1997), S. 122-128 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Surface roughness is one of the crucial factors in silicon fusion bonding. Due to the enhanced surface roughness, it is almost impossible to bond wafers after KOH etching. This also applies when wafers are heavily doped, have a thick LPCVD silicon nitride layer on top or have a LPCVD polysilicon layer of poor quality. It has been demonstrated that these wafers bond spontaneously after a very brief chemical mechanical polishing step. An adhesion parameter, that comprises of both the mechanical and chemical properties of the surface, is introduced when discussing the influence of surface roughness on the bondability. Fusion bonding, combined with a polishing technique, will broaden the applications of bonding techniques in silicon micromachining.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050068
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  • 5
    Electronic Resource
    Electronic Resource
    Injection molding and related techniques for fabrication of microstructures (1997)
    Springer
    Microsystem technologies 3 (1997), S. 129-133 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Injection molding technology and its different modifications represent established processes for manufacturing polymer products with high accuracy in large scale production. Enhanced machine and tool technologies like evacuation units and special temperization systems have already been adapted to the molding of microstructures with high aspect ratios. Cycle times are actually in the range of minutes and depend on the geometry of the microstructures and the materials used. Based on injection molding of lost plastic microforms new processes for the manufacturing of ceramic or metal microstructures are being developed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050069
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  • 6
    Electronic Resource
    Electronic Resource
    Low Z substrates for cost effective high-energy, stacked exposures (1997)
    Springer
    Microsystem technologies 4 (1997), S. 17-20 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Commercial application of the “direct” LIGA process requires solving two critical issues: throughput and price. Stacking of PMMA sheets bonded to substrates and exposed simultaneously with hard X-ray has been suggested recently. This paper presents a comparison of potential low Z substrates for stacked exposures in deep X-ray lithography based on elements of the second row of the periodic table. The transmission of various substrates considered for such an application have been calculated and experimentally determined. The transmission properties of materias such a beryllium, carbon, boron and compounds are by far better than that of silicon at lower photon energies typically used in LIGA applications, but this gain decreases with increasing photon energy. In stacked exposures, however, even small gains provide significant decrease in exposure time.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050084
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  • 7
    Electronic Resource
    Electronic Resource
    Precision of micromilled x-ray masks and exposures (1997)
    Springer
    Microsystem technologies 4 (1997), S. 21-24 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Micromechanical milling has been shown to be a rapid and direct method for the fabrication of structures with the geometry and size suitable for use as x-ray mask absorbers. While the micromilling process can not duplicate the size and resolution of absorber patterns created by high energy electron beam or optical lithography methods, micromilling can repeatedly create absorber line widths down to 10 micrometers, or less, with a one-sigma tolerance of 0.5 micrometers. A method for easily characterizing milling tool run out has been adapted so tool change out can be more routine. The milling process leaves some absorber burrs and the absorber is apparently tapered at the machined wall which introduce process biases, both of which add to exposure degradation. Nevertheless, based on work to date, it appears both of these effects can be reduced to acceptable limits.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050085
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  • 8
    Electronic Resource
    Electronic Resource
    X-Ray masks for very deep X-Ray lithography (1998)
    Springer
    Microsystem technologies 4 (1998), S. 70-73 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  The high aspect ratio, deep x-ray lithography and electrodeposition process [Becker et al. (1986)] can be expensive unless throughput is high enough. The use of a very high energy synchrotron has allowed the cost of exposure to be significantly reduced through simultaneous exposure of stacked photoresist [Guckel et al (1994)]. Synchrotron radiation at high photon energies has resulted the use of a large area x-ray mask. Both stacked exposures and a large area x-ray masks have significantly increased the throughput of the deep x-ray lithography and electrodeposition process.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050098
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  • 9
    Electronic Resource
    Electronic Resource
    Technology for movable microstructures - Transfer of laboratory processes to industrial production (1998)
    Springer
    Microsystem technologies 4 (1998), S. 120-121 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050111
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  • 10
    Electronic Resource
    Electronic Resource
    Slip casting of ceramic microcomponents (1998)
    Springer
    Microsystem technologies 4 (1998), S. 125-127 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050113
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