Conductive filament formation failure in a printed circuit board
Keith Rogers
(CALCE Electronic Products and Systems Consortium, University of Maryland, USA)
Craig Hillman
(CALCE Electronic Products and Systems Consortium, University of Maryland, USA)
Michael Pecht
(CALCE Electronic Products and Systems Consortium, University of Maryland, USA and)
Suzanne Nachbor
(Honeywell Inc., Minneapolis, USA)
397
Abstract
A defective printed circuit board assembly that exhibited excessive current leakage was examined to determine the responsible failure mechanisms. Observation of the failure site (determined electrically) by optical and electron microscopy revealed an area in the circuit board where debonded fiber bundles bridged a plated‐through‐hole (PTH) to a copper plane. This phenomenon is highly suggestive of conductive filament formation.
Keywords
Citation
Rogers, K., Hillman, C., Pecht, M. and Nachbor, S. (1999), "Conductive filament formation failure in a printed circuit board", Circuit World, Vol. 25 No. 3, pp. 6-8. https://doi.org/10.1108/03056129910268882
Publisher
:MCB UP Ltd
Copyright © 1999, MCB UP Limited