Summary
Polycide gate structures are widely used in ULSI (Ultra Large Scale Integration) devices. The distribution of the dopant between the various layers is of major concern. The effects of the fluorine incorporated during WSi2 deposition have been discussed because fluorine may diffuse into the gate oxide. We have studied the redistribution of boron, phosphorus and fluorine in WSi2/poly/SiO2/poly/SiO2/Si (bulk) gate structures by using hot e-gas SNMS and nuclear analyses (RBS/NRA), in samples subjected to thermal treatments that simulate the different steps of the ULSI fabrication sequence.
Similar content being viewed by others
References
Vaidya S, Retajczyk TF, Knoell RV (1985) J Vac Sci Technol B3:846–852
Gierish H, Neppl F, Frenzel E, Eichinger P, Hieber K (1987) J Vac Sci Technol B5:508–514
Shone FC, Saraswat KC, Plummer JD (1985) Proc of the Internat Electron Devices Meeting, Tech Dig, pp 407–410
Nygren S, Amm DT, Levy D, Torres J, Goltz G, D'Ouville TT, Delpech P (1989) IEEE Trans Electr Dev 36:1087–1093
Shioya Y, Kawamura S, Kobayashi I, Maeda M, Yanagida K (1987) J Appl Phys 61:5102–5109
Wright PJ, Saraswat KC (1989) IEEE Trans Electr Dev 36:879–889
Ohyu K, Itoga T, Nishioka Y, Natasuaki N (1989) Jap J Appl Phys 28:1041–1045
Nishioka Y, DaSilva EF, Jr, Wang Yy, Tso-Ping Ma (1988) IEEE Trans Electr Dev 9:38–40
Becker CH, Gillen KT (1984) Anal Chem 56:1671–1674
Oechsner H (1984) In: Oechsner H (ed) Thin film and depth profile analysis. Springer, Berlin Heidelberg New York, pp 63–85
Torres J, Thomas O, Jourdain D, Madar R, Perio A, Senateur JP (1988) J Appl Phys 63:732–742
Paihung Pan, Hsieh N, Geipel HJ, Jr, Slusser GJ (1982) J Appl Phys 53:3059
Murarka SP, Williams DS (1987) J Vac Sci Technol B5:1674–1688
Fukumooto M, Ohzone T (1987) Appl Phys Lett 50:894–896
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Moro, L., Lazzeri, P., Ottaviani, G. et al. SNMS studies of ULSI gate interconnection structures. Fresenius J Anal Chem 341, 20–24 (1991). https://doi.org/10.1007/BF00322100
Received:
Issue Date:
DOI: https://doi.org/10.1007/BF00322100