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Qin, S., Liu, C., Chen, J. et al. Characterization of thermal residual strain in SiCp/6061 Al composites by ultramicrohardness. Journal of Materials Science Letters 18, 1099–1100 (1999). https://doi.org/10.1023/A:1006616109746
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DOI: https://doi.org/10.1023/A:1006616109746