Abstract
A “Wallner Line” effect on the fracture surface of silicon is described and is used to determine a maximum fracture velocity of (3800 ± 400) m/s or (0.75 ± 0.07)v t. The mirror energy of silicon is also measured. The values are compared with those for glass and other materials and are shown to be consistent with a solid whose crack branching angle is restricted to 70‡.
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Greenwood, J.H. The maximum fracture velocity of silicon. J Mater Sci 6, 390–394 (1971). https://doi.org/10.1007/BF02403058
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DOI: https://doi.org/10.1007/BF02403058