Abstract
The effects of deposition temperature and mole ratio of CH4 to TiCl4 on the growth rate of titanium compound coatings were investigated. Activation energies of TiN, TiC x N y and TiC deposition reactions of 4.8×104, 1.9×105 and 2.8×105 J mol−1, respectively, were obtained experimentally. The carbon content of TiC x N y deposit was increased as the CH4 flow rate and deposition temperature increased. It was found that TiC x N y grain size was finer than TiC and TiN.
The cutting temperatures of TiN-coated and TiC-coated tools were 10% (TiN) and 20% (TiC) lower than that of uncoated tools. Feed force and reaction force of coated tools were 30% and 18% less than those of uncoated tools, respectively. The dominant failure mode of coated tools was due to the microchipping of the cutting edge.
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Cho, J.S., Nam, S.W. & Chun, J.S. Study of growth rate and failure mode of chemically vapour deposited TiN, TiCxNy and TiC on cemented tungsten carbide. J Mater Sci 17, 2495–2502 (1982). https://doi.org/10.1007/BF00543880
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DOI: https://doi.org/10.1007/BF00543880