Abstract
Effects of water and a variety of organic liquids on crack-growth rates in soda-lime-silica glass was investigated. When water is present in organic liquids, it is usually the principal agent that promotes subcritical crack growth in glass. In region I, subcritical crack growth is controlled primarily by the chemical potential of the water in the liquid; whereas in region II, crack growth is controlled by the concentration of water and the viscosity of the solution formed by the water and the organic liquid. In region III, where water does not affect crack growth, the slope of the crack-growth curves can be correlated with the dielectric constant of the liquid. It is suggested that these latter results can be explained by electrostatic interactions between the environment and charges that form during the rupture of Si-O bonds.
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Wiederhorn, S.M., Freiman, S.W., Fuller, E.R. et al. Effects of water and other dielectrics on crack growth. J Mater Sci 17, 3460–3478 (1982). https://doi.org/10.1007/BF00752191
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DOI: https://doi.org/10.1007/BF00752191