Abstract
It is observed that creep response in hot-pressed silicon is characterized by two parallel phenomena; one accounts for a persistent non-recoverable plastic deformation and the other for a transient viscoelastic recoverable deformation. The persistent creep component is time-dependent, and apparently follows parabolic time kinetics. It is further observed that creep is characterized by a power law stress exponent of about 4 and an activation energy of 848 kJ mol−1. The viscoelastic recoverable component of strain is found to be independent of the total plastic strain in the material. The recovery rate at any given time is directly proportional to the preceding creep stress and therefore can be considered linear viscoelastic. The creep compliance of the viscoelastic transient is temperature-dependent with an activation energy of about 722 kJ mol−1. It is further observed that the viscoelastic recovery is characterized by a spectrum of retardation times and can be modelled by a series of Kelvin analogue models. Finally, the viscoelastic recovery and the viscoelastic component of subsequent creep appear to be inversely related and apparently obey Boltzman superposition. A model is developed for the creep and recovery behaviour of hot-pressed silicon nitride consistent with all experimental observations and based in relative grain motion accommodated by the fluid grain-boundary glass liquid flow, cavitation and wedge opening.
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Arons, R.M., Tien, J.K. Creep and strain recovery in hot-pressed silicon nitride. J Mater Sci 15, 2046–2058 (1980). https://doi.org/10.1007/BF00550631
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DOI: https://doi.org/10.1007/BF00550631