Skip to main content
SpringerLink
Log in

Warpage of printed-circuit boards due to structural defects in glass-textolites

  • Published:
Mechanics of Composite Materials Aims and scope

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Literature cited

  1. V. V. Baranovskii and G. M. Dulitskaya, Laminated Plates for Electrotechnical Application [in Russian], Moscow (1976).

  2. N. M. Golub, “Current methods of making printed-circuit boards,” Radioelektron. Rubezhom,18, 26–34 (1978).

    Google Scholar 

  3. R. H. Jones, Mechanics of Composite Materials, Washington (1975).

  4. C. C. Chamis, “A theory for predicting composite laminate warpage resulting from fabrication,” Proc. 30th Tech. Conf. Reinforced Plast., Comp. Inst. Soc. of Plast. Ind. Sect. 18-c (1975).

  5. I. G. Zewi, I. M. Daniel, and J. T. Gotro, “Residual stresses and warpage in woven-glass/epoxy laminates,” Exp. Mech., No. 3, 44–50 (1987).

    Google Scholar 

  6. S. W. Tsai and H. T. Hahn, Introduction to Composite Materials, Westport, Conn. (1980).

  7. N. Laws, “Composite materials: theory and experiment,” J. Compos. Mater.,22, 394–400 (1988).

    Google Scholar 

  8. S. Tsai and H. Hahn, “Analysis of the fracture of composites,” in: Inelastic Properties of Composite Materials [Russian translation], Moscow (1978), pp. 104–139.

  9. H. T. Hahn, “Residual stresses in polymer matrix composite laminates,” J. Compos. Mater.,10, 265–274 (1976).

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Institute of Physical Chemistry, Academy of Sciences of the USSR, Moscow

    V. V. Bulatov, A. A. Gusev, A. P. Rod'kin, V. I. Zaitsev & É. F. Oleinik

  2. All-Union Scientific Research Institute of Electrical Insulating Materials, Moscow

    V. V. Bulatov, A. A. Gusev, A. P. Rod'kin, V. I. Zaitsev & É. F. Oleinik

Authors
  1. V. V. Bulatov
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. A. A. Gusev
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. A. P. Rod'kin
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. V. I. Zaitsev
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. É. F. Oleinik
    View author publications

    You can also search for this author in PubMed Google Scholar

Additional information

Translated from Mekhanika Kompozitnykh Materialov, No. 4, pp. 605–609, July–August, 1990.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Bulatov, V.V., Gusev, A.A., Rod'kin, A.P. et al. Warpage of printed-circuit boards due to structural defects in glass-textolites. Mech Compos Mater 26, 437–441 (1991). https://doi.org/10.1007/BF00612613

Download citation

  • Received:

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF00612613

Keywords

Search

Navigation