Abstract
Two new materials are proposed as models for photoelasticity and photoplasticity. One is cast resin fully cured epoxy-phenol alloy which is made by the mutual cross linking of pre-condensed resins of epoxy and phenol. While epoxy-phenol alloy resin is available only for photoelasticity, the other, polycarbonate resin, is useful not only for photoelasticity, but also for photoplasticity. Polycarbonate is very tough and has large values of both photoelastic stress sensitivity and modulus of elasticity. The excellent cold workability of polycarbonate is proved by a deep-drawing test. Hence the photoplastic results obtained from a polycarbonate model can be applied by analogy to the plastic stress analysis in other ductile materials. Both resins are very transparent even in the plastic state.
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Ito, K. New model materials for photoelasticity and photoplasticity. Experimental Mechanics 2, 373–376 (1962). https://doi.org/10.1007/BF02325594
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DOI: https://doi.org/10.1007/BF02325594