The thermal properties of bis-GMA-based resins containing a synthesized crystalline DME-TDC which was dissolved to bis-GAM/TEGDMA base resin by 10 or 20wt% were examined. Camphorquinone (0.5%) and a reducing agent (0.5%) were added to the base resin before the addition of DME-TDC. A thermoanalytical study using differential thermal analysis (DTA) and differential scanning calorimetry (DSC) showed that thermal change in the DTA and DSC curves depended on the composition of the bis-GMA-based resins. Heat for curing was lowest in 50/50 base resin of 40 wt% bis-GMA/60 wt% TEGDMA, 50/50 and 60/40 base resins in DTA analysis during heating. The addition of DME-TDC to each resin increased heat requirements in 50/50 resin and decreased heat requirements in 40/60 and 60/40 resins. The thermal decomposition of 50/50 bis-GMA-based resin including DME-TDC occurred at a higher temperature than that in 40/60 and 60/40 based resin. The value of activation energy for curing performance was lowest for a DME-TDC including bis-GMA-based resin.
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Tsuji, T., Wakasa, K. & Yamaki, M. Dental application of crystalline monomer with urethane linkages: a thermoanalytical study on bis-GMA-based resins. J Mater Sci: Mater Med 6, 396–399 (1995). https://doi.org/10.1007/BF00120280
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DOI: https://doi.org/10.1007/BF00120280