High-Temperature Breakdown Characteristics of δ-Doped In0.49Ga0.51P/GaAs/In0.25Ga0.75As/AlGaAs High Electron Mobility Transistor

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Copyright (c) 2000 The Japan Society of Applied Physics
, , Citation Ching-Sung Lee et al 2000 Jpn. J. Appl. Phys. 39 L1029 DOI 10.1143/JJAP.39.L1029

1347-4065/39/10B/L1029

Abstract

A δ-doped In0.49Ga0.51P/GaAs/In0.25Ga0.75As/AlGaAs high electron mobility transistor exhibiting high breakdown voltage at high temperature and excellent pinch-off properties has been successfully fabricated by low-pressure metalorganic chemical vapor deposition (LP-MOCVD). The gate-to-drain breakdown voltages are as high as 62 V (300 K) and 42 V (500 K) contributed by δ-doping the high band-gap In0.49Ga0.51P insulator layer. An improved gate voltage swing of about 2.3 V is also achieved. Furthermore, the device demonstrated excellent pinch-off properties when a carrier-retarding AlGaAs buffer layer was inserted. The above results indicate that the present structure is promising for high power and high temperature ambient device applications.

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10.1143/JJAP.39.L1029