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Phase transition and anomalous scaling in the quantum Hall transport of topological-insulator SnBi1.1Sb0.9Te2S devices

Faji Xie, Shuai Zhang, Qianqian Liu, Chuanying Xi, Ting-Ting Kang, Rui Wang, Boyuan Wei, Xing-Chen Pan, Minhao Zhang, Fucong Fei, Xuefeng Wang, Li Pi, Geliang L. Yu, Baigeng Wang, and Fengqi Song
Phys. Rev. B 99, 081113(R) – Published 13 February 2019

Abstract

The scaling physics of quantum Hall transport in optimized topological insulators with a plateau precision of 1/1000e2/h is considered. Two exponential scaling regimes are observed in temperature-dependent transport dissipation, one of which accords with thermal-activation behavior with a gap of 2.8 meV (>20 K), the other being attributed to variable-range hopping (1–20 K). Magnetic-field-driven plateau-to-plateau transition gives scaling relations of (dRxy/dB)maxTκ and ΔB1Tκ with a consistent exponent of κ ∼ 0.2, which is half the universal value for a conventional two-dimensional electron gas. This is evidence of percolation assisted by quantum tunneling and reveals the dominance of electron-electron interaction of the topological surface states.

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  • Received 6 December 2018

DOI:https://doi.org/10.1103/PhysRevB.99.081113

©2019 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Faji Xie1,*, Shuai Zhang1,*, Qianqian Liu1, Chuanying Xi2, Ting-Ting Kang3, Rui Wang1, Boyuan Wei1, Xing-Chen Pan1, Minhao Zhang1, Fucong Fei1, Xuefeng Wang4, Li Pi2, Geliang L. Yu1, Baigeng Wang1,†, and Fengqi Song1,‡

  • 1National Laboratory of Solid State Microstructures, College of Physics and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China
  • 2High Magnetic Field Laboratory, Chinese Academy of Sciences and Collaborative Innovation Center of Advanced Microstructures, Hefei 230031, China
  • 3State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
  • 4National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China

  • *These authors contributed equally to this work.
  • Corresponding author: bgwang@nju.edu.cn
  • Corresponding author: songfengqi@nju.edu.cn

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Issue

Vol. 99, Iss. 8 — 15 February 2019

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