ExLibris header image
SFX Logo
Title: Study of molybdenum‐aluminum interdiffusion kinetics and contact resistance for VLSI applications
Source:

Journal of Applied Physics [0021-8979] Singh, R N yr:1985


Collapse list of basic services Basic
Full text
Full text available via AIP Digital Archive
GO
Document delivery
Request document via Library/Bibliothek GO

Expand list of advanced services Advanced
A service provided by the Library of the Wissenschaftspark Albert Einstein, Potsdam, Germany.
© 2005 SFX by Ex Libris Inc.