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A study of the adhesion of copper to polyimide foils using surface analytical techniques

Untersuchung der Adhäsion von Kupfer an Polyimidfolien mit Hilfe von oberflächenanalytischen Verfahren

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Summary

The adhesion of chemically and electrochemically deposited copper films on commercial polyimide foils has been studied using scanning electron microscopy, photoelectron spectroscopy, EDX and IR reflection-absorption spectroscopy. Experiments have been carried out on the bare surface and the deposited layers as well as on surfaces prepared by peeling off the deposits. The results show that, at least for the case considered here, poor adhesion is caused by cohesion failure in the foil itself, and that a thin surface layer of the polyimide foil is important for the interface bond. IR spectroscopy was used to study the molecular nature of this surface layer.

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Authors and Affiliations

  1. Fritz-Haber-Institut der Max-Planck-Gesellschaft, D-1000, Berlin 33

    K. Horn, A. M. Bradshaw, K. Doblhofer, S. Krause & G. Weinberg

  2. Abteilung GT-EC, Schering AG, D-1000, Berlin 65

    H. -M. Seidenspinner & R. Schulz

Authors
  1. K. Horn
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  2. A. M. Bradshaw
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  3. K. Doblhofer
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  4. S. Krause
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  5. G. Weinberg
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  6. H. -M. Seidenspinner
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  7. R. Schulz
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Horn, K., Bradshaw, A.M., Doblhofer, K. et al. A study of the adhesion of copper to polyimide foils using surface analytical techniques. Z. Anal. Chem. 333, 590–595 (1989). https://doi.org/10.1007/BF00572382

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  • DOI: https://doi.org/10.1007/BF00572382

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