Superconductivity proximate to antiferromagnetism in a copper-oxide monolayer grown on Bi2Sr2CaCu2O8+δ

Shuai Wang, Long Zhang, and Fa Wang
Phys. Rev. B 97, 035112 – Published 9 January 2018

Abstract

A nodeless superconducting (SC) gap was reported in a recent scanning tunneling spectroscopy experiment of a copper-oxide monolayer grown on a Bi2Sr2CaCu2O8+δ (Bi2212) substrate [Zhong et al., Sci. Bull. 61, 1239 (2016)], which is in stark contrast to the nodal d-wave pairing gap in the bulk cuprates. Motivated by this experiment, we first show with first-principles calculations that the tetragonal CuO (T-CuO) monolayer on the Bi2212 substrate is more stable than the commonly postulated CuO2 structure. The T-CuO monolayer is composed of two CuO2 layers sharing the same O atoms. The band structure is obtained by first-principles calculations, and its strong electron correlation is treated with the renormalized mean-field theory. We argue that one CuO2 sublattice is hole doped while the other sublattice remains half filled and may have antiferromagnetic (AF) order. The doped Cu sublattice can show d-wave SC; however, its proximity to the AF Cu sublattice induces a spin-dependent hopping, which splits the Fermi surface and may lead to a full SC gap. Therefore, the nodeless SC gap observed in the experiment could be accounted for by the d-wave SC proximity to an AF order, thus it is extrinsic rather than intrinsic to the CuO2 layers.

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  • Received 20 July 2017
  • Revised 27 December 2017

DOI:https://doi.org/10.1103/PhysRevB.97.035112

©2018 American Physical Society

Physics Subject Headings (PhySH)

  1. Research Areas
Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Shuai Wang1, Long Zhang2, and Fa Wang1,3

  • 1International Center for Quantum Materials, School of Physics, Peking University, Beijing 100871, China
  • 2Kavli Institute for Theoretical Sciences, University of Chinese Academy of Sciences, Beijing 100190, China
  • 3Collaborative Innovation Center of Quantum Matter, Beijing 100871, China

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Issue

Vol. 97, Iss. 3 — 15 January 2018

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