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Poly(arylene ether imidazole) surfacing films for flat and parabolic structuresFilms of thermoplastic poly(arylene ether imidazole)s (PAEI)s are used as surface modifiers for neat resin panels and composite resin panels. The PAEI polymer contains imidazole groups along the backbone which co-cure, i.e., react chemically, with epoxies or bismaleimides during processing and thereby provide excellent adhesion between the PAEI film and an epoxy or bismaleimide neat resin or composite resin facesheet. The film provides good adhesion and a smooth surface to the finished part and acts as a release agent from the mold. The as-processed integral structures have very smooth (specular) surfaces, and since the film releases readily from a glass mold, no release agent is necessary. The PAEI film is thermally stable, resistant to electron radiation, and adheres tenaciously to the facesheet. The film maintains good adhesion even after thermal cycling from room temperature to .about. -196.degree. C.
Document ID
20080004146
Acquisition Source
Headquarters
Document Type
Other - Patent
Authors
Connell, John W.
Towell, Timothy W.
Tompkins, Stephen S.
Date Acquired
August 24, 2013
Publication Date
March 5, 1996
Subject Category
Composite Materials
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-PATENT-5,496,639
Patent Application
US-PATENT-APPL-SN-238102

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