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Stress and buckling analysisAn analysis is presented of elastic stress and buckling behavior due to thermal stresses in silicon ribbon. Thermal profiles for reducing stresses and improving flatness in wide ribbon are discussed.
Document ID
19850024126
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Dillon, O. W., Jr. (Kentucky Univ. Lexington, KY, United States)
Date Acquired
August 12, 2013
Publication Date
October 1, 1984
Publication Information
Publication: JPL Proc. of the 24th Project Integration Meeting
Subject Category
Energy Production And Conversion
Accession Number
85N32439
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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IDRelationTitle19850024081Collected WorksProceedings of the 24th Project Integration Meeting
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