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High resolution, low cost solar cell contact developmentThe experimental work demonstrating the feasibility of the MIDFILM process as a low cost means of applying solar cell collector metallization as reported. Cell efficiencies of above 14% (AMl, 28 C) were achieved with fritted silver metallization. Environmental tests suggest that the metallization is slightly humidity sensitive and degradation is observed on cells with high series resistance. The major yield loss in the fabrication of cells was due to discontinuous grid lines, resulting in high series resitance. Standard lead-tin solder plated interconnections do not appear compatible with the MIDFILM contact. Copper, nickel and molybdemun base powder were investigated as low cost metallization systems. The copper based powder degraded the cell response. The nickel and molybdenum base powders oxidized when sintered in the oxidizing atmosphere necessary to ash the photoresin.
Document ID
19800018283
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Mardesich, N.
(Spectrolab, Inc. Sylmar, CA, United States)
Date Acquired
September 4, 2013
Publication Date
December 1, 1979
Subject Category
Energy Production And Conversion
Report/Patent Number
NASA-CR-163289
JPL-9950-368
DOE/JPL-955298-80/2
Accession Number
80N26782
Funding Number(s)
CONTRACT_GRANT: JPL-955298
CONTRACT_GRANT: NAS7-100
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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