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X-ray topography as a process control tool in semiconductor and microcircuit manufactureA bent wafer camera, designed to identify crystal lattice defects in semiconductor materials, was investigated. The camera makes use of conventional X-ray topographs and an innovative slightly bent wafer which allows rays from the point source to strike all portions of the wafer simultaneously. In addition to being utilized in solving production process control problems, this camera design substantially reduces the cost per topograph.
Document ID
19770023347
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Parker, D. L. (Texas A&M Univ. College Station, TX, United States)
Porter, W. A. (Texas A&M Univ. College Station, TX, United States)
Date Acquired
August 8, 2013
Publication Date
May 1, 1977
Publication Information
Publication: NASA. Marshall Space Flight Center Proc. of the ASPE(MSFC Symp. on Eng. and Productivity Gains from Space Technol.
Subject Category
Engineering (General)
Accession Number
77N30291
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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IDRelationTitle19770023329Collected WorksProceedings of the ASPE/MSFC Symposium on Engineering and Productivity Gains from Space Technology
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