Unidirectional solidification of monovariant CuNiMg eutectic alloys II. Microstructures and properties
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Cited by (10)
In situ observation of solidification patterns in diffusive conditions
2016, Acta MaterialiaCitation Excerpt :Then, the question arises of knowing how do regular (straight or zigzag) lamellar eutectics form within an ordinary experimental time. The answer is that this occurs easily when the isotherms are not exactly perpendicular to the main growth axis, but slightly slanted, due to a (possibly tuneable) asymmetry of the instrument [249]. The thermal misalignment (or bias) imposes a global drift of the pattern, thus a progressive elimination of the initial labyrinth pattern, and the propagation of a well-ordered lamellar pattern.
Eutectic and peritectic solidification patterns
2016, Current Opinion in Solid State and Materials ScienceMicrostructural design of new high conductivity - High strength Cu-based alloy
2015, Journal of Alloys and CompoundsCitation Excerpt :In an attempt to find an alternative, we focused on the Cu–Mg system for two main reasons (1) Mg affects only weakly the electrical conductivity of Cu [7] and (2) in contract with Cu–Cr and Cu–Ag, it provides several degree of freedom to generate microstructures (eutectic transformation, driving forces for precipitation). Studies of Cu–Mg alloys are not numerous and mainly limited to the aging response of low alloyed compositions [8–11] apart from the work of Fehrenbach et al. [12] and Fidler et al. [13] on the eutectic transformation. In order to obtain high strength – high conductivity materials, an alloy design was performed in the Cu–Mg system from the thermodynamic properties of the studied system.
Factors affecting the room-temperature mechanical properties of TiCr<inf>2</inf>-base Laves phase alloys
1998, Materials Science and Engineering: AUnidirectional solidification of eutectic and eutectoid alloys
1974, Journal of Crystal Growth
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Present address: Fuel Materials Branch, Atomic Energy of Canada Ltd., Chalk River, Ontario, Canada.