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18 μm electrodeposited copper foil for flex fatigue applications

Harish D. Merchant (Gould Electronics, Eastlake, Ohio, US)
Melvin G. Minor Jr (Gould Electronics, Eastlake, Ohio, US)
Sid J. Clouser (Gould Electronics, Eastlake, Ohio, US)
Dan T. Leonard (Gould Electronics, Eastlake, Ohio, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 March 1999

375

Abstract

The strain‐based flex fatigue of 18 μm thick copper foil is evaluated over a wide range of strain amplitudes. Seven electrodeposited foils, four commercial grades and three experimental foils, and a commercial grade rolled foil are characterized. The fatigue life versus cyclic strain amplitude curve in the high strain amplitude (low cycle) and low strain amplitude (high cycle) regimes is developed for each foil. On the basis of fatigue life (Nf) and fatigue ductility (Df), the low cycle fatigue performance of eight foils is ranked. Universal correlations of Nf and Df with the uniaxial tensile strength are established. Two electrodeposited foils, experimental foil DF 8 in the high strain amplitude regime and commercial foil DF 9 in the low strain amplitude regime, have been shown to display fatigue performance comparable to that of the commercial rolled GR 8 foil.

Keywords

Citation

Merchant, H.D., Minor, M.G., Clouser, S.J. and Leonard, D.T. (1999), "18 μm electrodeposited copper foil for flex fatigue applications", Circuit World, Vol. 25 No. 1, pp. 38-46. https://doi.org/10.1108/03056129910244842

Publisher

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MCB UP Ltd

Copyright © 1999, MCB UP Limited

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