Reliability assessment for development of microtechnologies

Abstract

 In recent years, developments in the micro electronics industry have focused on semiconductors and semiconductor processes. However, microcircuit assembly technologies have lagged chip development. This has spurred research in interconnection and packaging creating many new technologies and enhancing integration. These new microelectronic technologies are enabling micro systems, and resulting in products, from portable work stations to advanced automotive electronics. This evolution of technology has also created the need to reexamine how we achieve a reliable system. Clearly, in highly competitive marketplaces, reliability is a key element in achieving successful products. To achieve a reliable product in a cost effective manner, “upstream problem solving” must be employed which focuses on root cause of failure. This paper provides an overview of the reliability assessment process needed to achieve effective microsystem development. A case study of reliability in a complex multi-chip module is presented which includes an assessment of the stochastic nature of via fatigue by applying Monte Carlo simulations.