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Lower temperature tannin/hexamine-bonded particleboard of improved performance

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  1. ENSTIB, Universitè de Nancy 1, Epinal, France

    H. Heinrich, F. Pichelin & A. Pizzi

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  1. H. Heinrich
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  2. F. Pichelin
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  3. A. Pizzi
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Heinrich, H., Pichelin, F. & Pizzi, A. Lower temperature tannin/hexamine-bonded particleboard of improved performance. Holz als Roh-und Werkstoff 54, 262 (1996). https://doi.org/10.1007/s001070050178

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  • DOI: https://doi.org/10.1007/s001070050178

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