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Some Thermal Properties of a Copper–Tin Alloy

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Abstract

The thermal properties (heat capacity, thermal diffusivity, and electrical resistivity) of a Cu + 10 wt% Sn alloy in both solid and liquid phases have been reported. Using these values it was confirmed that the Lorenz relation is suitable for obtaining thermal conductivity from electrical resistivity in the liquid phase of this alloy. Also, the temperature differential (dλ/dT) obtained from such an approach was in excellent agreement with the thermal conductivity values calculated from thermal diffusivity.

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Authors and Affiliations

  1. National Physical Laboratory, Teddington, London, TW11 OLW, United Kingdom

    B. J. Monaghan, J. G. J. Neale & L. Chapman

Authors
  1. B. J. Monaghan
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  2. J. G. J. Neale
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  3. L. Chapman
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Monaghan, B.J., Neale, J.G.J. & Chapman, L. Some Thermal Properties of a Copper–Tin Alloy. International Journal of Thermophysics 20, 1051–1060 (1999). https://doi.org/10.1023/A:1022694518254

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