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Further examinations of carbon/polyesterimide thick-film resistors

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Abstract

A carbon (carbon black and/or graphite)/polyesterimide resin system has been used as a material for polymer thick-film resistors. The physical and chemical properties of this system as a function of curing temperature were evaluated by means of resistance measurements during the curing process, thermogravimetric analysis, adhesion measurements and scanning electron microscopy examinations. The temperature range between 250 and 300 ‡C has been chosen as the most suitable. The basic electrical properties and the resistance stability to low and high temperature shocks and humidity exposure have been evaluated in relation to the conductive filler used in the ink.

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References

  1. K. GILLEO, in Proceedings of Thirty-Ninth Electronic Components Conference, Houston, 1989, p. 37.

  2. K. Russel, Electron. Packag. Prod. 31 (1991), 68.

    Google Scholar 

  3. E. LO, C. HUANG and S. J. STEIN, in Proceedings of Fifth European Hybrid Microelectronics Conference, Stresa, 1985, p. 537.

  4. C. HUANG, S. J. STEIN and E. LO, in Proceedings of Thirty-Sixth Electronic Components Conference, Seattle, 1986, p. 464.

  5. N. KOM ATSU and I. YAMAGUCHI, in Proceedings of the International Symposium on Microelectronics (ISHM-USA), 1987, p. 113.

  6. M. SEITZ, R. HIRSCHE and M. POLCZY\`NSKI, in Proceedings of the International Symposium on Microelectronics (ISHM-USA), 1990, p. 295.

  7. R. W. VEST, Conduction mechanisms in thick film micro-circuits, Purdue Research Foundation, Final Technical Report, ARPA order no.1642 (1975).

  8. A. Dziedzic, Microelectron. J. 19 (1988) 24.

    Google Scholar 

  9. A. Dziedzic and L. Golonka, J. Mater. Sci. 23 (1988) 3151.

    Google Scholar 

  10. H. CZARCZY\`NSKA, A. DZIEDZIC, B. W. LICZNERSKI, M. łUKASZEWICZ and A. SEWERYN, Microelectron. J. 23 (1992).

  11. A. DZIEDZIC, H. CZARCZY\`NSKA and B. W. LICZNERSKI, Int. J. Electron.

  12. S.-L. Fu, M.-S. Liang, T. Shiramatsu and T. S. Wu, IEEE Trans. Comp. Hybr. Manuf. Technol. CHMT-4 (1981) 283.

    Google Scholar 

  13. S. Nakamura, A. Ito, G. Sawa, S. Orita and K. Tubota, NEC Res. Dev. 83 (1986) 121.

    Google Scholar 

  14. R. Subramanian, M. T. Pottinger, J. H. Morris and J. P. Curilla, in MRS Symposium Proceedings on Materials Science of High Temperature Polymers for Microelectronics, 227 (1991) 147.

    Google Scholar 

  15. R. Puffr and J. Sebenda, J. Polym. Sci. C 16 (1976) 79.

    Google Scholar 

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Authors and Affiliations

  1. Institute of Electron Technology, Technical University of Wrocŀaw, Wybrzeźe Wyspiańškiego 27, 50-370, Wrocŀaw, Poland

    A. Dziedzic, H. Czarczyńska & B. W. Licznerski

  2. FB-18 Technical Physics, Kassel University, Heinrich Plettstrasse 40, D-3500, Kassel, Germany

    I. Rangelov

Authors
  1. A. Dziedzic
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  2. H. Czarczyńska
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  3. B. W. Licznerski
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  4. I. Rangelov
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Dziedzic, A., Czarczyńska, H., Licznerski, B.W. et al. Further examinations of carbon/polyesterimide thick-film resistors. J Mater Sci: Mater Electron 4, 233–240 (1993). https://doi.org/10.1007/BF00224747

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  • DOI: https://doi.org/10.1007/BF00224747

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