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Evaluation of epoxy underfill materials for solder flip-chip technology

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Journal of Materials Science Letters

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References

  1. T. D. DUDDERAR, Y. DEGANI, J. SPADAFORA, K. L. TAI and R. C. FRYE, in Proceedings of the 1994 International Conference on Multichip Modules, Denver, USA, April 1994, p. 266.

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  4. J. H. LAU, in “Chip on Board Technologies for Multichip Modules” (Van Norstrand Reinhold, 1994).

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Authors and Affiliations

  1. Pohang University of Science and Technology, San 31 Hyoja-Dong, Pohang, 790-784, South Korea

    C. E. PARK

  2. Lucent Bell Laboratories, 700 Mountain Avenue, Murray Hill, NJ, 07974, USA

    B. J. HAN, H. E. BAIR & V. R. RAJU

Authors
  1. C. E. PARK
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  2. B. J. HAN
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  3. H. E. BAIR
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  4. V. R. RAJU
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PARK, C.E., HAN, B.J., BAIR, H.E. et al. Evaluation of epoxy underfill materials for solder flip-chip technology. Journal of Materials Science Letters 16, 1027–1029 (1997). https://doi.org/10.1023/A:1018562221627

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  • DOI: https://doi.org/10.1023/A:1018562221627

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