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Laser drilling in heat sensitive components

  • Brief Reports
  • Tagung der Schweizerischen Physikalischen Gesellschaft in Lausanne am 14. und 15. April 1977 Weitere Mitteilungen (Allgemeine Physik, Festkörperphysik, Kernphysik und theoretische Physik) siehe HPA 50, Heft 5, 1977 Allgemeine und angewandte Physik
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Abstract

From a theoretical model of the laser drilling process [2] and from heat conduction theory the temperature distribution in a target during and after drilling is investigated. The results are applied to the drilling of holes through the substrate of LED's up to 15 μm beneath the active region without damaging them thermally.

Zusammenfassung

Anhand eines theoretischen Modells zum Laser-Bohrprozess [2] und der Wärmeleittheorie wird die Temperaturverteilung in einem Target während und nach dem Bohrprozess untersucht. Die Resultate werden angewendet, um Löcher durch das Substrat von LED's bis 15 μm an die aktive Schicht heran zu bohren, ohne diese thermisch zu zerstören.

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References

  1. F. Porret, Technical Digest of International Electron Device Meeting, Washington, 637 (1976).

  2. M. von Allmen, J. Appl. Phys.47, 5460 (1976).

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  3. S. I. Anisimov, Ya. A. Imas, G. S. Romanov andYu. V. Khodyko, Nat. Tech. Info. Serv. JPRS-53241 (1971).

  4. H. S. Carlslaw andJ. C. Jaeger,Conduction of Heat in Solids, Oxford University Press, New York (1959).

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Authors and Affiliations

  1. Institute of Applied Physics, University of Berne, Berne, Switzerland

    K. Affolter & M. von Allmen

Authors
  1. K. Affolter
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  2. M. von Allmen
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Affolter, K., von Allmen, M. Laser drilling in heat sensitive components. Journal of Applied Mathematics and Physics (ZAMP) 28, 1182–1187 (1977). https://doi.org/10.1007/BF01601696

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  • DOI: https://doi.org/10.1007/BF01601696

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