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Simulation analysis the effect of heat sink fins on the high-power LED

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Published under licence by IOP Publishing Ltd
, , Citation D S Peng et al 2019 IOP Conf. Ser.: Mater. Sci. Eng. 474 012050 DOI 10.1088/1757-899X/474/1/012050

1757-899X/474/1/012050

Abstract

In this study, the heat dissipation of high-power LED with different heat sink fin thickness and space values is analyzed in detail, in order to tackle the problem of high-power LED overheating. It is shown that an increase in the heat sink fins' thickness initially improves the high-power LED cooling effect, but this improvement is not obvious until the above thickness reaches 3 mm. At the same time, the heat sink fins' space can also enhance the cooling effect, but when it attains 5mm, the cooling ability is decreased instead. Through the comparative analysis of the thermal performance of high-power LED with different heat sink fins thickness and space values, it is proved that the junction temperature is minimum, when the heat sink fin thickness and space are 3 and 5mm, respectively.

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10.1088/1757-899X/474/1/012050