ExLibris header image
SFX Logo
Title: Linear coefficients of thermal expansion of Au0.5Ni0.5Sn4, Au0.75Ni0.25Sn4, and AuSn4
Source:

Scripta Materialia [1359-6462] Pitely, Susan yr:2004


Collapse list of basic services Basic
Sorry, no full text available...
Please use the document delivery service (see below)  
Holding information
Holdings in library search engine ALBERT GO
Document delivery
Request document via Library/Bibliothek GO
Users interested in this article also expressed an interest in the following:
1. Elmer, J W. "Superplastic creep of AuSn eutectic solder alloy." Scripta materialia 120 (2016): 14-18. Link to SFX for this item
2. Mwema, F M. "Properties of physically deposited thin aluminium film coatings: A review." Journal of alloys and compounds 747 (2018): 306-323. Link to SFX for this item
3. Leroy, W. "Method to Determine the Sticking Coefficient of O-2 on Deposited Al During Reactive Magnetron Sputtering, Using Mass Spectrometry." Plasma processes and polymers 2009. Link to Full Text for this item Link to SFX for this item
4. Semaltianos, NG. "Thermally evaporated aluminium thin films." Applied surface science 183.3-4 (2001): 223-229. Link to Full Text for this item Link to SFX for this item
Select All Clear All

Expand list of advanced services Advanced
A service provided by the Library of the Wissenschaftspark Albert Einstein, Potsdam, Germany.
© 2005 SFX by Ex Libris Inc.