Surface- and pressure-induced bulk Kondo breakdown in SmB6

K. Chen, T-C. Weng, G. Schmerber, V. N. Gurin, J.-P. Kappler, Q. Kong, F. Baudelet, A. Polian, and L. Nataf
Phys. Rev. B 97, 235153 – Published 29 June 2018

Abstract

Motivated by the prediction of surface Kondo breakdown in topological Kondo insulators, we investigated the valence and magnetism of SmB6 with x-ray absorption and magnetic circular dichroism at the Sm M4,5 and L2 edges with surface and bulk sensitivity, respectively. A higher Sm valence state at the surface and in the bulk under pressure indicates the surface- and pressure-induced bulk Kondo breakdown. We confirmed the different magnetization origin from the surface (f electron) to the bulk (d electron) and ascertained the direct relationship between the disappearance of the Sm L2-edge x-ray magnetic circular dichroism signal and the closure of the df hybridization gap in SmB6 bulk under pressure, paving the way for further investigations of the Kondo insulators. Above Pc=8.5 GPa, a more localized 4f state with higher valence and the disappearing of the 5d magnetism are observed, suggesting the closure of the hybridization gap in the bulk.

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  • Received 2 March 2018
  • Revised 13 June 2018

DOI:https://doi.org/10.1103/PhysRevB.97.235153

©2018 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

K. Chen1,*, T-C. Weng2, G. Schmerber3, V. N. Gurin4, J.-P. Kappler1, Q. Kong1, F. Baudelet1, A. Polian1,5, and L. Nataf1

  • 1Synchrotron SOLEIL, L'Orme des Merisiers, Saint-Aubin-BP48, 91192 Gif-sur-Yvette Cedex, France
  • 2Center for High Pressure Science & Technology Advanced Research, 1690 Cailun Road, 201203 Shanghai, China
  • 3IPCMS, CNRS-Université de Strasbourg, 23 rue du Loess, BP 43, 67034 Strasbourg Cedex 2, France
  • 4Ioffe Institute, Russian Academy of Sciences, St. Petersburg 194021, Russia
  • 5IMPMC, Sorbonne Université, C.N.R.S. UMR 7590, 4 Place Jussieu, 75005 Paris, France

  • *kaichen.hzg@gmail.com

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Issue

Vol. 97, Iss. 23 — 15 June 2018

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