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Multi-Layer Wireless Sensor Construct for Use at Electrically-Conductive Material SurfacesA multi-layer wireless sensor construct is provided. The construct includes a first dielectric layer adapted to be attached to a portion of a first surface of an electrically-conductive material. A layer of mu metal is provided on the first dielectric layer. A second dielectric layer is provided on the layer of mu metal. An electrical conductor is provided on the second dielectric layer wherein the second dielectric layer separates the electrical conductor from the layer of mu metal. The electrical conductor has first and second ends and is shaped to form an unconnected open-circuit that, in the presence of a time-varying magnetic field, resonates to generate a harmonic magnetic field response having a frequency, amplitude and bandwidth.
Document ID
20190000783
Acquisition Source
Headquarters
Document Type
Other - Patent
Authors
Dudley, Kenneth L.
Szatkowski, George N.
Wang, Chuantong
Smith, Laura J.
Ticatch, Larry A.
Nguyen, Truong X.
Ely, Jay J.
Koppen, Sandra V.
Date Acquired
February 14, 2019
Publication Date
January 15, 2019
Subject Category
Electronics And Electrical Engineering
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-Patent-10,180,341
Patent Application
US-Patent-Appl-SN-14/520,785

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