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Heat rejection sublimatorA sublimator includes a sublimation plate having a thermal element disposed adjacent to a feed water channel and a control point disposed between at least a portion of the thermal element and a large pore substrate. The control point includes a sintered metal material. A method of dissipating heat using a sublimator includes a sublimation plate having a thermal element and a control point. The thermal element is disposed adjacent to a feed water channel and the control point is disposed between at least a portion of the thermal element and a large pore substrate. The method includes controlling a flow rate of feed water to the large pore substrate at the control point and supplying heated coolant to the thermal element. Sublimation occurs in the large pore substrate and the controlling of the flow rate of feed water is independent of time. A sublimator includes a sublimation plate having a thermal element disposed adjacent to a feed water channel and a control point disposed between at least a portion of the thermal element and a large pore substrate. The control point restricts a flow rate of feed water from the feed water channel to the large pore substrate independent of time.
Document ID
20100007934
Acquisition Source
Headquarters
Document Type
Other - Patent
Authors
Dingell, Charles W.
Quintana, Clemente E.
Le, Suy
Clark, Michael R.
Cloutier, Robert E.
Hafermalz, David Scott
Date Acquired
August 25, 2013
Publication Date
October 20, 2009
Subject Category
Fluid Mechanics And Thermodynamics
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-Patent-7,604,782
Patent Application
US-Patent-Appl-SN-11/625,670

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