Abstract
The fluorine doping process of pure silica “soot” with various type of fluorine gases in the vapour-phase axial deposition (VAD) sintering process was investigated in detail. This investigation showed that the doping level is proportional to the 1/4 power of the concentration of the fluorine gas, and the achievable reduction of relative refractive index is −0.75% with this process. The kinetic investigation clarified that the fluorine doping process consists of the doping and dissociation reactions; the former reaction obeys the 1/2 power of the SiF4 partial pressure and the latter the two power of fluorine content [SiO1.5F], where SiO1.5F represents a silicon tetrahedron consisting of one fluorine and three bridging oxygen atoms in glass. The fluorine content is proportional to the 1/4 power of the SiF4 partial pressure at an equilibrium where the doping reaction is in competition with the dissociation reaction.
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Kyoto, M., Ito, M., Ishiguro, Y. et al. Study of fluorine doping during vapour-phase axial deposition sintering process. J Mater Sci 31, 2481–2486 (1996). https://doi.org/10.1007/BF01152965
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DOI: https://doi.org/10.1007/BF01152965