ISSN:
1077-3118
Source:
AIP Digital Archive
Topics:
Physics
Notes:
Boron ion implantations were performed into 100 nm thick, undoped, strained Si1−xGex alloy films with x values of 0, 0.1, and 0.2 grown on (100) Si. B implants of 1×1013, 1×1014, and 1×1015 cm−2 were done at 20 keV. Implant activation was accomplished by using either 20 s rapid thermal anneals or 10 min furnace anneals, both at temperatures up to 800 °C. The annealed material was characterized by Hall, secondary ion mass spectrometry, and x-ray rocking curve measurements. We observed an increasing B activation with increasing Ge concentration in the alloy. For x=0.2 we obtained 100% B activation for 1×1013 and 1×1014 cm−2 implants annealed at 700 and 800 °C. © 1996 American Institute of Physics.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.116695
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