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  • 1
    Publication Date: 2019-07-13
    Description: This paper presents the preliminary results of an on-going study of the near-tip mechanics of mode-I cracking in brittle matrix composite laminates. A finite element model is developed within the context of two competing characteristic lengths present in the composite: the microstructural length (the thickness of the layers) and a macro-length (crack-length, uncracked ligament size, etc.). For various values of the parameters which describe the ratio of these lengths and the constituent properties, the stresses ahead of a crack perpendicular to the laminates are compared with those predicted by assuming the composite is homogeneous orthotropic. The results can be used to determine the conditions for which homogenization can provide a sufficiently accurate description of the stresses in the vicinity of the crack-tip.
    Keywords: STRUCTURAL MECHANICS
    Type: AIAA PAPER 92-2491 , AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference; Apr 13, 1992 - Apr 15, 1992; Dallas, TX; United States
    Format: text
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  • 2
    Publication Date: 2019-08-26
    Description: At least one tactile sensor includes an insulating layer and a conductive layer formed on the surface of the insulating layer. The conductive layer defines at least one group of flexible projections extending orthogonally from the surface of the insulating layer. The flexible projections include a major projection extending a distance orthogonally from the surface and at least one minor projection that is adjacent to and separate from the major projection wherein the major projection extends a distance orthogonally that is greater than the distance that the minor projection extends orthogonally. Upon a compressive force normal to, or a shear force parallel to, the surface, the major projection and the minor projection flex such that an electrical contact resistance is formed between the major projection and the minor projection. A capacitive tactile sensor is also disclosed that responds to the normal and shear forces.
    Keywords: Electronics and Electrical Engineering
    Format: application/pdf
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