ISSN:
1573-0409
Keywords:
atomic force microscopy
;
force sensor
;
force control
;
microassembly
;
micromanipulation
;
nanomanipulation
;
sensor fusion
;
sensor integration
;
visual servoing
Source:
Springer Online Journal Archives 1860-2000
Topics:
Computer Science
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Abstract For microassembly tasks uncertainty exists at many levels. Single static sensing configurations are therefore unable to provide feedback with the necessary range and resolution for accomplishing many desired tasks. In this paper we present experimental results that investigate the integration of two disparate sensing modalities, force and vision, for sensor-based microassembly. By integrating these sensing modes, we are able to provide feedback in a task-oriented frame of reference over a broad range of motion with an extremely high precision. An optical microscope is used to provide visual feedback down to micron resolutions, while an optical beam deflection technique (based on a modified atomic force microscope) is used to provide nanonewton level force feedback or nanometric level position feedback. Visually servoed motion at speeds of up to 2 mm/s with a repeatability of 0.17 μm are achieved with vision alone. The optical beam deflection sensor complements the visual feedback by providing positional feedback with a repeatability of a few nanometers. Based on the principles of optical beam deflection, this is equivalent to force measurements on the order of a nanonewton. The value of integrating these two disparate sensing modalities is demonstrated during controlled micropart impact experiments. These results demonstrate micropart approach velocities of 80 μm/s with impact forces of 9 nN and final contact forces of 2 nN. Within our microassembly system this level of performance cannot be achieved using either sensing modality alone. This research will aid in the development of complex hybrid MEMS devices in two ways; by enabling the microassembly of more complex MEMS prototypes; and in the development of automatic assembly machines for assembling and packaging future MEMS devices that require increasingly complex assembly strategies.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1023/A:1008136711577
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