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  • NONMETALLIC MATERIALS  (2)
  • MATERIALS, NONMETALLIC  (1)
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  • 1
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    Unknown
    Improved high-temperature resistant matrix resins (1989)
    In:  CASI
    Details
    Publication Date: 2019-06-28
    Description: A study was performed with the objective of developing matrix resins that exhibit improved thermo-oxidative stability over state-of-the-art high temperature resins for use at temperatures up to 644 K (700 F) and air pressures up to 0.7 MPa (100 psia). The work was based upon a TRW discovered family of polyimides currently licensed to and marketed by Ethyl Corporation as EYMYD(R) resins. The approach investigated to provide improved thermo-oxidative properties was to use halogenated derivatives of the diamine, 2, 2-bis (4-(4-aminophenoxy)phenyl) hexafluoropropane (4-BDAF). Polyimide neat resins and Celion(R) 12,000 composites prepared from fluorine substituted 4-BDAF demonstrated unexpectedly lower glass transition temperatures (Tg) and thermo-oxidative stabilities than the baseline 4-BDAF/PMDA polymer.
    Keywords: NONMETALLIC MATERIALS
    Type: NASA-CR-180826 , NAS 1.26:180826
    Format: application/pdf
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    NASA TECHNICAL REPORTS
  • 2
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    Unknown
    Feasibility study for the development of low temperature curing adhesives (1974)
    In:  CASI
    Details
    Publication Date: 2019-07-13
    Description: The feasibility of a new approach for the development of stable, easily handled, room temperature (293 K - 311 K) curing adhesives was studied and demonstrated. The work concentrated on a family of unsaturated amide/ester resins. Twelve candidate resins were synthesized and tested for completeness of cure at room temperature, adhesion to aluminum and titanium, shear strength, moisture resistance and heat stability. The three most promising candidate resins were selected and recommended for further development.
    Keywords: MATERIALS, NONMETALLIC
    Type: NASA-CR-132422 , TRW-22743-6009-RU-00
    Format: application/pdf
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    NASA TECHNICAL REPORTS
  • 3
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    Unknown
    The development of low temperature curing adhesives (1975)
    In:  CASI
    Details
    Publication Date: 2019-07-13
    Description: An approach for the development of a practical low temperature (293 K-311 K/68 F-100 F) curing adhesive system based on a family of amide/ester resins was studied and demonstrated. The work was conducted on resin optimization and adhesive compounding studies. An improved preparative method was demonstrated which involved the reaction of an amine-alcohol precursor, in a DMF solution with acid chloride. Experimental studies indicated that an adhesive formulation containing aluminum powder provided the best performance when used in conjunction with a commercial primer.
    Keywords: NONMETALLIC MATERIALS
    Type: NASA-CR-132751 , TRW-26415-6015-RU-00
    Format: application/pdf
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    NASA TECHNICAL REPORTS
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