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  • 1
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    Etching Integrated Circuits (1983)
    In:  Other Sources
    Details
    Publication Date: 2019-06-28
    Description: 20-page report reviews methods available for etching specific layers on wafers and discusses automation techniques and features on one particular automated system. Compares two major etching methods, chemical (wet) and plasma (dry), and discusses areas in need of development. Methods covered include "dip-and-dunk" manual method of chemical etching, automated chemical etching, and plasma etching.
    Keywords: FABRICATION TECHNOLOGY
    Type: MFS-25661 , NASA Tech Briefs (ISSN 0145-319X); 7; 1; P. 108
    Format: text
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    NASA TECHNICAL REPORTS
  • 2
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    Automatic chemical vapor deposition (1981)
    In:  Other Sources
    Details
    Publication Date: 2019-06-28
    Description: Report reviews chemical vapor deposition (CVD) for processing integrated circuits and describes fully automatic machine for CVD. CVD proceeds at relatively low temperature, allows wide choice of film compositions (including graded or abruptly changing compositions), and deposits uniform films of controllable thickness at fairly high growth rate. Report gives overview of hardware, reactants, and temperature ranges used with CVD machine.
    Keywords: FABRICATION TECHNOLOGY
    Type: MFS-25249 , NASA Tech Briefs (ISSN 0145-319X); 5; 3; P. 393
    Format: text
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    NASA TECHNICAL REPORTS
  • 3
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    An automated oxide and diffusion facility for IC's (1980)
    In:  Other Sources
    Details
    Publication Date: 2019-06-28
    Description: Report discusses totally-automated oxidation and diffusion facility for fabricating IC's. Several innovations are demonstrated: process controller specifically designed for semiconductor processing; automatic loading system to accept wafers from air track, insert them in quartz carrier, and place carrier on paddle for insertion into furnace; automatic unloading of wafers back onto air track; and boron diffusion using diborane.
    Keywords: FABRICATION TECHNOLOGY
    Type: MFS-25357 , NASA Tech Briefs (ISSN 0145-319X); 5; 2; P. 246
    Format: text
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    NASA TECHNICAL REPORTS
  • 4
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    An automated photolithography facility for IC's (1980)
    In:  Other Sources
    Details
    Publication Date: 2019-06-28
    Description: Report discusses subsystems that will constitute fully-automated photolithography facility for IC's. Facility being developed at Marshall Space Flight Center will produce ultrareliable IC's with minimal human intervention.
    Keywords: FABRICATION TECHNOLOGY
    Type: MFS-25073 , NASA Tech Briefs (ISSN 0145-319X); 5; 1; P. 116
    Format: text
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    NASA TECHNICAL REPORTS
  • 5
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    Automated ion implantation for IC's (1980)
    In:  Other Sources
    Details
    Publication Date: 2019-06-28
    Description: Report discusses automated ion-implantation facility under development at Marshall Space Flight Center. Facility will produce ultra-reliable IC's with minimal human intervention.
    Keywords: FABRICATION TECHNOLOGY
    Type: MFS-25193 , NASA Tech Briefs (ISSN 0145-319X); 5; 1; P. 115
    Format: text
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    NASA TECHNICAL REPORTS
  • 6
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    Improved universal electrical connector (1972)
    In:  CASI
    Details
    Publication Date: 2019-06-27
    Description: Universal electrical connector for use with various types of electric cable, inserts, and pin styles is described. Connector may be used over variety of environmental conditions. Details of construction are discussed. Illustrations of connector are included.
    Keywords: ELECTRONIC COMPONENTS AND CIRCUITS
    Type: MFS-14741
    Format: application/pdf
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    NASA TECHNICAL REPORTS
  • 7
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    A new low-expansion nonflammable printed circuit board (1970)
    In:  CASI
    Details
    Publication Date: 2019-06-27
    Description: Printed circuit board has a thermal coefficient of expansion similar to that of the electronic component leads. High-expansion composite materials are sandwiched between the outer layers of copper and woven fiber glass.
    Keywords: ELECTRONIC COMPONENTS AND CIRCUITS
    Type: MFS-20408
    Format: application/pdf
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    NASA TECHNICAL REPORTS
  • 8
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    UV detector monitors organic contamination of optical surfaces (1968)
    In:  CASI
    Details
    Publication Date: 2019-06-27
    Description: Silicon carbide, insensitive to visible light, is used in photodetectors. System contamination can be monitored during the normal operation without interference to the operator, and without shielding from ambient light.
    Keywords: ELECTRONIC COMPONENTS AND CIRCUITS
    Type: MFS-20246
    Format: application/pdf
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    NASA TECHNICAL REPORTS
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