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  • 1
    Publication Date: 2019-07-13
    Description: This report documents an investigation into observed failures associated with conducted susceptibility testing of Crew Quarters (CQ) hardware in the Johnson Space Center (JSC) Electromagnetic Interference (EMI) Measurement Facility, and the work accomplished to identify the source of the observed behavior. Investigation led to the conclusion that the hardware power input impedance was interacting with the facility power impedance leading to instability at the observed frequencies of susceptibility. Testing performed in other facilities did not show this same behavior, pointing back to the EMI Measurement Facility power as the potential root cause. A LISN emulating the Station power bus impedance was inserted into the power circuit, and the susceptibility was eliminated from the measurements.
    Keywords: Electronics and Electrical Engineering
    Type: JSC-CN-23221 , 2011 IEEE International Symposium on Electromagnetic Compatibility; Aug 14, 2011 - Aug 19, 2011; Long Beach, CA; United States
    Format: application/pdf
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  • 2
    Publication Date: 2019-07-12
    Description: Test process, milestones and inputs are unknowns to first-time users of the EMI/EMC Test Facility. The User Test Planning Guide aids in establishing expectations for both NASA and non-NASA facility customers. The potential audience for this guide includes both internal and commercial spaceflight hardware/software developers. It is intended to assist their test engineering personnel in test planning and execution. Material covered includes a roadmap of the test process, roles and responsibilities of facility and user, major milestones, facility capabilities, and inputs required by the facility. Samples of deliverables, test article interfaces, and inputs necessary to define test scope, cost, and schedule are included as an appendix to the guide.
    Keywords: Electronics and Electrical Engineering
    Type: JSC-CN-24742
    Format: application/pdf
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  • 3
    Publication Date: 2019-07-13
    Description: This slide presentation reviews the Space Shuttle electromagnetic compatibility (EMC). It includes an overview of the design of the shuttle with the areas that are of concern for the electromagnetic compatibility. It includes discussion of classical electromagnetic interference (EMI) and the work performed to control the electromagnetic interference. Another area of interest is electrostatic charging and the threat of electrostatic discharge and the attempts to reduce damage to the Shuttle from these possible hazards. The issue of electrical bonding is als reviewed. Lastly the presentation reviews the work performed to protect the shuttle from lightning, both in flight and on the ground.
    Keywords: Electronics and Electrical Engineering
    Type: JSC-CN-8690 , 2004 IEEE International Symposium on Electromagnetic Compatibility; Aug 09, 2004 - Aug 13, 2004; Santa Clara, CA; United States
    Format: application/pdf
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  • 4
    Publication Date: 2019-07-12
    Description: A method for automated fabrication of flexible, electrically conductive patterns on cloth substrates has been demonstrated. Products developed using this method, or related prior methods, are instances of a technology known as 'e-textiles,' in which electrically conductive patterns ar formed in, and on, textiles. For many applications, including high-speed digital circuits, antennas, and radio frequency (RF) circuits, an e-textile method should be capable of providing high surface conductivity, tight tolerances for control of characteristic impedances, and geometrically complex conductive patterns. Unlike prior methods, the present method satisfies all three of these criteria. Typical patterns can include such circuit structures as RF transmission lines, antennas, filters, and other conductive patterns equivalent to those of conventional printed circuits. The present method overcomes the limitations of the prior methods for forming the equivalent of printed circuits on cloth. A typical fabrication process according to the present method involves selecting the appropriate conductive and non-conductive fabric layers to build the e-textile circuit. The present method uses commercially available woven conductive cloth with established surface conductivity specifications. Dielectric constant, loss tangent, and thickness are some of the parameters to be considered for the non-conductive fabric layers. The circuit design of the conductive woven fabric is secured onto a non-conductive fabric layer using sewing, embroidery, and/or adhesive means. The portion of the conductive fabric that is not part of the circuit is next cut from the desired circuit using an automated machine such as a printed-circuit-board milling machine or a laser cutting machine. Fiducials can be used to align the circuit and the cutting machine. Multilayer circuits can be built starting with the inner layer and using conductive thread to make electrical connections between layers.
    Keywords: Electronics and Electrical Engineering
    Type: MSC-24115-1 , NASA Tech Briefs, June 2008; 20
    Format: application/pdf
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