Publication Date:
2019-07-13
Description:
Presentation at the annual NASA Electronic Parts and Packaging (NEPP) Program Electronic Technology Workshop (ETW). The material includes an update of progress in this NEPP task area over the past year, which includes testing, evaluation, and analysis of radiation effects data on the IBM 32 nm silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) process. The testing was conducted using test vehicles supplied by directly by IBM.
Keywords:
Electronics and Electrical Engineering
Type:
GSFC-E-DAA-TN16640
,
GSFC-E-DAA-TN15575
,
Annual Electronic Technology Workshop (ETW); Jun 17, 2014 - Jun 19, 2014; Greenbelt, MD; United States
Format:
application/pdf
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