ALBERT

Description: This assessment was initiated by the NASA Engineering & Safety Center (NESC) after a number of recent "high profile" connector problems, the most visible and publicized of these being the problem with the Space Shuttle's Engine Cut-Off System cryogenic feed-thru connector. The NESC commissioned a review of NASA's connector selection and application processes for space flight applications, including how lessons learned and past problem records are fed back into the processes to avoid recurring issues. Team members were primarily from the various NASA Centers and included connector and electrical parts specialists. The commissioned study was conducted on spacecraft connector selection and application processes at NASA Centers. The team also compared the NASA spacecraft connector selection and application process to the military process, identified recent high profile connector failures, and analyzed problem report data looking for trends and common occurrences. The team characterized NASA's connector problem experience into a list of top connector issues based on anecdotal evidence of a system's impact and commonality between Centers. These top issues are as follows, in no particular rank order: electrically shorted, bent and/or recessed contact pins, contact pin/socket contamination leading to electrically open or intermittencies, connector plating corrosion or corrosion of connector components, low or inadequate contact pin retention forces, contact crimp failures, unmated connectors and mis-wiring due to workmanship errors during installation or maintenance, loose connectors due to manufacturing defects such as wavy washer and worn bayonet retention, damaged connector elastomeric seals and cryogenic connector failure. A survey was also conducted of SAE Connector AE-8C1 committee members regarding their experience relative to the NASA concerns on connectors. The most common responses in order of occurrence were contact retention, plating issues, worn-out or damaged coupling mechanisms, bent pins, contact crimp barrel cracking and torn seals. In addition to these common themes, responses included issues with markings, dimensional errors on the build, contact/socket damage (handling), manufacturing defects and customer misapplication and mishandling. The NESC team concluded that considering the large quantity and wide variety of connectors successfully flown on human and robotic space applications, the number of failures is quite low. However, "high profile" failures with significant cost, schedule, safety, and/or mission success impacts continue to occur. It was also concluded that connector failures occur throughout a system's life-cycle with the majority of connector issues application related. A number of recommendations were identified for improving NASA connector selection processes and overall space connector reliability and performance.

Description: Charging System Analyzer Program (Nascap-2K) is a comprehensive update, revision, and extension of several NASA and Air Force codes for predicting electrical charging of spacecraft. Nascap-2K integrates the capabilities and models included in four independent programs: NASCAP/LEO for low-Earth orbits, NASCAP/GEO for geosynchronous orbits, POLAR for auroral charging in polar orbits, and DynaPAC (Dynamic Plasma Analysis Code) for time-dependent plasma interactions. While each of the earlier codes works well for the range of problems for which it was designed, by today s standards these codes are difficult to learn, cumbersome to use, and overly restrictive in their geometric modeling capabilities. Nascap-2K incorporates these models into a single software package that includes spacecraft surface modeling, spatial gridding, environmental specifications, calculating scripting, and post-processing analysis and visualization. The provided material properties database includes values from earlier programs as well as values from recent measurements. Development of Nascap-2K continues with future capabilities to include interactions with dense plasma such as those produced by electric propulsion.

Description: During post-flight processing of STS-116, damage to crewmember Robert Curbeam's Phase VI Glove Thermal Micrometeoroid Garment was discovered. This damage consisted of: loss of RTV-157 palm pads on the thumb area on the right glove, a 0.75 inch cut in the Vectran adjacent to the seam and thumb pad (single event cut), constituting the worst glove damage ever recorded for the U.S. space program. The underlying bladder and restraint were found not be damaged by this event. Evaluation of glove damage found that the outer Vectran fibers were sliced as a result of contact with a sharp edge or pinch point rather than general wear or abrasion (commonly observed on the RTV pads). Damage to gloves was also noted on STS-118 and STS-120. One potential source of EMU glove damages are sharp crater lips on external handrails, generated by micrometeoroid and orbital debris (MMOD) impacts. In this paper, the results of a hypervelocity impact (HVI) test program on representative and actual ISS handrails are presented. These tests were performed in order to characterize impact damage profiles on ISS handrails and evaluate alternatives for limiting risk to future missions. It was determined that both penetrating and non-penetrating MMOD impacts on aluminum and steel ISS handrails are capable of generating protruding crater profiles which exceed the heights required for EMU glove abrasion risk by an order of magnitude. Testing demonstrated that flexible overwraps attached to the outside of existing handrails are capable of limiting contact between hazardous crater formations and crewmember gloves during extravehicular activity (EVA). Additionally, replacing metallic handrails with high strength, low ductility, fiber reinforced composite materials would limit the formation of protruding crater lips on new ISS modules.

Description: A combined content addressable memory device and memory interface is provided. The combined device and interface includes one or more one molecular wire crossbar memories having spaced-apart key nanowires, spaced-apart value nanowires adjacent to the key nanowires, and configurable switches between the key nanowires and the value nanowires. The combination further includes a key microwire-nanowire grid (key MNG) electrically connected to the spaced-apart key nanowires, and a value microwire-nanowire grid (value MNG) electrically connected to the spaced-apart value nanowires. A key or value MNGs selects multiple nanowires for a given key or value.

Description: Auto-Generated Semantic Processing (AGSP) Services is a suite of software tools for automated generation of other computer programs, denoted cross-platform semantic adapters, that support interoperability of computer-based communication systems that utilize a variety of both new and legacy communication software running in a variety of operating- system/computer-hardware combinations. AGSP has numerous potential uses in military, space-exploration, and other government applications as well as in commercial telecommunications. The cross-platform semantic adapters take advantage of common features of computer- based communication systems to enforce semantics, messaging protocols, and standards of processing of streams of binary data to ensure integrity of data and consistency of meaning among interoperating systems. The auto-generation aspect of AGSP Services reduces development time and effort by emphasizing specification and minimizing implementation: In effect, the design, building, and debugging of software for effecting conversions among complex communication protocols, custom device mappings, and unique data-manipulation algorithms is replaced with metadata specifications that map to an abstract platform-independent communications model. AGSP Services is modular and has been shown to be easily integrable into new and legacy NASA flight and ground communication systems.

Description: This viewgraph presentation reviews the standards for space flight hardware based on human capabilities and limitations. The contents include: 1) Scope; 2) Applicable documents; 3) General; 4) Human Physical Characteristics and Capabilities; 5) Human Performance and Cognition; 6) Natural and Induced Environments; 7) Habitability Functions; 8) Architecture; 9) Hardware and Equipment; 10) Crew Interfaces; 11) Spacesuits; 12) Operatons: Reserved; 13) Ground Maintenance and Assembly: Reserved; 14) Appendix A-Reference Documents; 15) Appendix N-Acronyms and 16) Appendix C-Definition. Volume 2 is supported by the Human Integration Design Handbook (HIDH)s.

Description: A video guidance sensor system for use, p.g., in automated docking of a chase vehicle with a target vehicle. The system includes an integrated rangefinder sub-system that uses time of flight measurements to measure range. The rangefinder sub-system includes a pair of matched photodetectors for respectively detecting an output laser beam and return laser beam, a buffer memory for storing the photodetector outputs, and a digitizer connected to the buffer memory and including dual amplifiers and analog-to-digital converters. A digital signal processor processes the digitized output to produce a range measurement.

Description: This presentation discusses fractured leads on field-programmable gate array (FPGA) during flight vibration. Actions taken to determine root cause and resolution of the failure include finite element analysis (FEA) and vibration testing and scanning electron microscopy (with X-ray microanalysis) and energy dispersive spectrometry (SEM/EDS) failure assessment. Bonding methods for surface mount parts is assessed, including critical analysis and assessment of random fatigue damage. Regarding ceramic quad flat pack (CQFP) lead fracture, after disassembling the attitude control electronics (ACE) configuration, photographs showed six leads cracked on FPGA RTSX72SU-1 CQ208B package located on the RWIC card. An identical package (FPGA RTSX32SU-1 CQ208B) mounted on the RWIC did not results in cracked pins due to vibration. FPGA lead failure theories include workmanship issues in the lead-forming, material defect in the leads of the FPGA packages, and the insecure mounting of the board in the card guides, among other theories. Studies were conducted using simple calculations to determine the response and fatigue life of the package. Shorter packages exhibited more response when loaded by out-of-plane displacement of PCB while taller packages exhibit more response when loaded by in-plane acceleration of PCB. Additionally, under-fill did not contribute to reducing stress in leads due to out-of-plane PCB loading or from component twisting, as much as corner bonding. The combination of corner bond and under-fill is best to address mechanical and thermal S/C environment. Test results of bonded parts showed reduced (dampened) amplitude and slightly shifted peaks at the un-bonded natural frequency and an additional response at the bonded frequency. Stress due to PCBB out-of-plane loading was decreased on in the corners when only a corner bond was used. Future work may address CQFP fatigue assessment, including the investigation of discrepancy in predicted fatigue damage, as well as comparing fatigue life and fatigue damage cycle ration computed using FEA and Miner's rule to results from a fatigue assessment software program.

Description: This viewgraph presentation discusses the process of measuring radiofrequency and microwave radiation from various signal strengths. The topics include: 1) Limits and Guidelines; 2) Typical Variable Standard (IEEE) Frequency Dependent; 3) FCC Standard 47 CFR 1.1310; 4) Compliance Follows Unity Rule; 5) Multiple Sources Contribute; 6) Types of RF Signals; 7) Interfering Radiations; 8) Different Frequencies Different Powers; 9) Power Summing - Peak Power; 10) Contribution from Various Single Sources; 11) Total Power from Multiple Sources; 12) Are You Out of Compliance?; and 13) In Compliance.

Description: This viewgraph presentation reviews the design of the electrical systems that are required for the testing of rockets at the Rocket Propulsion Facility at NASA Stennis Space Center (NASA SSC). NASA/SSC s Mission in Rocket Propulsion Testing Is to Acquire Test Performance Data for Verification, Validation and Qualification of Propulsion Systems Hardware. These must be accurate reliable comprehensive and timely. Data acquisition in a rocket propulsion test environment is challenging: severe temporal transient dynamic environments, large thermal gradients, vacuum to 15 ksi pressure regimes SSC has developed and employs DAS, control systems and control systems and robust instrumentation that effectively satisfies these challenges.