ALBERT

Description: This assessment was initiated by the NASA Engineering & Safety Center (NESC) after a number of recent "high profile" connector problems, the most visible and publicized of these being the problem with the Space Shuttle's Engine Cut-Off System cryogenic feed-thru connector. The NESC commissioned a review of NASA's connector selection and application processes for space flight applications, including how lessons learned and past problem records are fed back into the processes to avoid recurring issues. Team members were primarily from the various NASA Centers and included connector and electrical parts specialists. The commissioned study was conducted on spacecraft connector selection and application processes at NASA Centers. The team also compared the NASA spacecraft connector selection and application process to the military process, identified recent high profile connector failures, and analyzed problem report data looking for trends and common occurrences. The team characterized NASA's connector problem experience into a list of top connector issues based on anecdotal evidence of a system's impact and commonality between Centers. These top issues are as follows, in no particular rank order: electrically shorted, bent and/or recessed contact pins, contact pin/socket contamination leading to electrically open or intermittencies, connector plating corrosion or corrosion of connector components, low or inadequate contact pin retention forces, contact crimp failures, unmated connectors and mis-wiring due to workmanship errors during installation or maintenance, loose connectors due to manufacturing defects such as wavy washer and worn bayonet retention, damaged connector elastomeric seals and cryogenic connector failure. A survey was also conducted of SAE Connector AE-8C1 committee members regarding their experience relative to the NASA concerns on connectors. The most common responses in order of occurrence were contact retention, plating issues, worn-out or damaged coupling mechanisms, bent pins, contact crimp barrel cracking and torn seals. In addition to these common themes, responses included issues with markings, dimensional errors on the build, contact/socket damage (handling), manufacturing defects and customer misapplication and mishandling. The NESC team concluded that considering the large quantity and wide variety of connectors successfully flown on human and robotic space applications, the number of failures is quite low. However, "high profile" failures with significant cost, schedule, safety, and/or mission success impacts continue to occur. It was also concluded that connector failures occur throughout a system's life-cycle with the majority of connector issues application related. A number of recommendations were identified for improving NASA connector selection processes and overall space connector reliability and performance.

Description: A combined content addressable memory device and memory interface is provided. The combined device and interface includes one or more one molecular wire crossbar memories having spaced-apart key nanowires, spaced-apart value nanowires adjacent to the key nanowires, and configurable switches between the key nanowires and the value nanowires. The combination further includes a key microwire-nanowire grid (key MNG) electrically connected to the spaced-apart key nanowires, and a value microwire-nanowire grid (value MNG) electrically connected to the spaced-apart value nanowires. A key or value MNGs selects multiple nanowires for a given key or value.

Description: A video guidance sensor system for use, p.g., in automated docking of a chase vehicle with a target vehicle. The system includes an integrated rangefinder sub-system that uses time of flight measurements to measure range. The rangefinder sub-system includes a pair of matched photodetectors for respectively detecting an output laser beam and return laser beam, a buffer memory for storing the photodetector outputs, and a digitizer connected to the buffer memory and including dual amplifiers and analog-to-digital converters. A digital signal processor processes the digitized output to produce a range measurement.

Description: This presentation discusses fractured leads on field-programmable gate array (FPGA) during flight vibration. Actions taken to determine root cause and resolution of the failure include finite element analysis (FEA) and vibration testing and scanning electron microscopy (with X-ray microanalysis) and energy dispersive spectrometry (SEM/EDS) failure assessment. Bonding methods for surface mount parts is assessed, including critical analysis and assessment of random fatigue damage. Regarding ceramic quad flat pack (CQFP) lead fracture, after disassembling the attitude control electronics (ACE) configuration, photographs showed six leads cracked on FPGA RTSX72SU-1 CQ208B package located on the RWIC card. An identical package (FPGA RTSX32SU-1 CQ208B) mounted on the RWIC did not results in cracked pins due to vibration. FPGA lead failure theories include workmanship issues in the lead-forming, material defect in the leads of the FPGA packages, and the insecure mounting of the board in the card guides, among other theories. Studies were conducted using simple calculations to determine the response and fatigue life of the package. Shorter packages exhibited more response when loaded by out-of-plane displacement of PCB while taller packages exhibit more response when loaded by in-plane acceleration of PCB. Additionally, under-fill did not contribute to reducing stress in leads due to out-of-plane PCB loading or from component twisting, as much as corner bonding. The combination of corner bond and under-fill is best to address mechanical and thermal S/C environment. Test results of bonded parts showed reduced (dampened) amplitude and slightly shifted peaks at the un-bonded natural frequency and an additional response at the bonded frequency. Stress due to PCBB out-of-plane loading was decreased on in the corners when only a corner bond was used. Future work may address CQFP fatigue assessment, including the investigation of discrepancy in predicted fatigue damage, as well as comparing fatigue life and fatigue damage cycle ration computed using FEA and Miner's rule to results from a fatigue assessment software program.

Description: This viewgraph presentation discusses the process of measuring radiofrequency and microwave radiation from various signal strengths. The topics include: 1) Limits and Guidelines; 2) Typical Variable Standard (IEEE) Frequency Dependent; 3) FCC Standard 47 CFR 1.1310; 4) Compliance Follows Unity Rule; 5) Multiple Sources Contribute; 6) Types of RF Signals; 7) Interfering Radiations; 8) Different Frequencies Different Powers; 9) Power Summing - Peak Power; 10) Contribution from Various Single Sources; 11) Total Power from Multiple Sources; 12) Are You Out of Compliance?; and 13) In Compliance.

Description: This viewgraph presentation reviews the design of the electrical systems that are required for the testing of rockets at the Rocket Propulsion Facility at NASA Stennis Space Center (NASA SSC). NASA/SSC s Mission in Rocket Propulsion Testing Is to Acquire Test Performance Data for Verification, Validation and Qualification of Propulsion Systems Hardware. These must be accurate reliable comprehensive and timely. Data acquisition in a rocket propulsion test environment is challenging: severe temporal transient dynamic environments, large thermal gradients, vacuum to 15 ksi pressure regimes SSC has developed and employs DAS, control systems and control systems and robust instrumentation that effectively satisfies these challenges.

Description: A single-chip CMOS-based (complementary-metal-oxide-semiconductorbased) transmit/receive (T/R) module is being developed for L-band radar systems. Previous T/R module implementations required multiple chips employing different technologies (GaAs, Si, and others) combined with off-chip transmission lines and discrete components including circulators. The new design eliminates the bulky circulator, significantly reducing the size and mass of the T/R module. Compared to multi-chip designs, the single-chip CMOS can be implemented with lower cost. These innovations enable cost-effective realization of advanced phased array and synthetic aperture radar systems that require integration of thousands of T/R modules. The circulator is a ferromagnetic device that directs the flow of the RF (radio frequency) power during transmission and reception. During transmission, the circulator delivers the transmitted power from the amplifier to the antenna, while preventing it from damaging the sensitive receiver circuitry. During reception, the circulator directs the energy from the antenna to the low-noise amplifier (LNA) while isolating the output of the power amplifier (PA). In principle, a circulator could be replaced by series transistors acting as electronic switches. However, in practice, the integration of conventional series transistors into a T/R chip introduces significant losses and noise. The prototype single-chip T/R module contains integrated transistor switches, but not connected in series; instead, they are connected in a shunt configuration with resonant circuits (see figure). The shunt/resonant circuit topology not only reduces the losses associated with conventional semiconductor switches but also provides beneficial transformation of impedances for the PA and the LNA. It provides full singlepole/ double-throw switching for the antenna, isolating the LNA from the transmitted signal and isolating the PA from the received signal. During reception, the voltage on control line RX/TX (raised bar) is high, causing the field-effect transistor (FET) switch S1 to be closed, forming a parallel resonant tank circuit L1||C1. This circuit presents high impedance to the left of the antenna, so that the received signal is coupled to the LNA. At the same time, FET switches S2 and S3 are open, so that C2 is removed from the circuit (except for a small parasitic capacitance). The combination of L2 and C3 forms a matching network that transforms the antenna impedance of 50 ohms to a higher value from the perspective of the LNA input terminal. This transformation of impedance improves LNA noise figure by increasing the received voltage delivered to the input transistor. This allows lower transconductance and therefore a smaller transistor, which makes it possible to design the CMOS LNA for low power consumption. During transmission, the voltage on control line RX/TX (raised bar) is low, causing switch S1 to be open. In this configuration, the combination of L1 and C1 transforms the antenna impedance to a lower value from the perspective of the PA. This low impedance is helpful in producing a relatively high output power compatible with the low CMOS operating potential. At the same time, switches S2 and S3 are closed, forming the parallel resonant tank circuit L2||C2. This circuit presents high impedance to the right of the antenna, directing the PA output signal to the antenna and away from the LNA. During this time, S3 presents a short circuit across the LNA input terminals to guarantee that the voltage seen by the LNA is small enough to prevent damage.

Description: Space Solar Power (SSP), combined with Wireless Power Transmission (WPT), offers the far-term potential to solve major energy problems on Earth. In the long term, we aspire to beam energy to Earth from geostationary Earth orbit (GEO), or even further distances in space. In the near term, we can beam power over more moderate distances, but still stretch the limits of today s technology. In recent studies, a 100 kWe-class "Power Plug" Satellite and a 10 kWe-class Lunar Polar Solar Power outpost have been considered as the first steps in using these WPT options for SSP. Our current assessments include consideration of orbits, wavelengths, and structural designs to meet commercial, civilian government, and military needs. Notional transmitter and receiver sizes are considered for use in supplying 5 to 40 MW of power. In the longer term, lunar or asteroidal material can be used. By using SSP and WPT technology for near-term missions, we gain experience needed for sound decisions in designing and developing larger systems to send power from space to Earth.