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  • ELECTRONICS AND ELECTRICAL ENGINEERING  (4)
  • 1980-1984  (4)
  • 1
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    Control electronics for a multi-laser/multi-detector scanning system (1980)
    In:  CASI
    Details
    Publication Date: 2019-06-27
    Description: The Mars Rover Laser Scanning system uses a precision laser pointing mechanism, a photodetector array, and the concept of triangulation to perform three dimensional scene analysis. The system is used for real time terrain sensing and vision. The Multi-Laser/Multi-Detector laser scanning system is controlled by a digital device called the ML/MD controller. A next generation laser scanning system, based on the Level 2 controller, is microprocessor based. The new controller capabilities far exceed those of the ML/MD device. The first draft circuit details and general software structure are presented.
    Keywords: ELECTRONICS AND ELECTRICAL ENGINEERING
    Type: NASA-CR-163565 , RPI-TR-MP-73
    Format: application/pdf
    Location Call Number Expected Availability
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    NASA TECHNICAL REPORTS
  • 2
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    Wireless, in-vessel neutron monitor for initial core-loading of advanced breeder reactors (1981)
    In:  CASI
    Details
    Publication Date: 2019-06-28
    Description: An experimental wireless, in-vessel neutron monitor was developed to measure the reactivity of an advanced breeder reactor as the core is loaded for the first time to preclude an accidental critically incident. The environment is liquid sodium at a temperature of approx. 220 C, with negligible gamma or neutron radiation. With ultrasonic transmission of neutron data, no fundamental limitation was observed after tests at 230 C for 2000 h. The neutron sensitivity was approx. 1 count/s-nv, and the potential data transmission rate was approx. 10,000 counts/s.
    Keywords: ELECTRONICS AND ELECTRICAL ENGINEERING
    Type: NASA. Lewis Research Center Proc. of the Conf. on High-Temp. Electron.; p 89-92
    Format: application/pdf
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    NASA TECHNICAL REPORTS
  • 3
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    Chemical etching for automatic processing of integrated circuits (1981)
    In:  CASI
    Details
    Publication Date: 2019-06-28
    Description: Chemical etching for automatic processing of integrated circuits is discussed. The wafer carrier and loading from a receiving air track into automatic furnaces and unloading onto a sending air track are included.
    Keywords: ELECTRONICS AND ELECTRICAL ENGINEERING
    Type: NASA-TM-82411 , NAS 1.15:82411
    Format: application/pdf
    Location Call Number Expected Availability
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    NASA TECHNICAL REPORTS
  • 4
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    Chemical vapor deposition for automatic processing of integrated circuits (1980)
    In:  CASI
    Details
    Publication Date: 2019-06-28
    Description: Chemical vapor deposition for automatic processing of integrated circuits including the wafer carrier and loading from a receiving air track into automatic furnaces and unloading on to a sending air track is discussed. Passivation using electron beam deposited quartz is also considered.
    Keywords: ELECTRONICS AND ELECTRICAL ENGINEERING
    Type: NASA-TM-78274 , NAS 1.15:78274
    Format: application/pdf
    Location Call Number Expected Availability
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    NASA TECHNICAL REPORTS
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