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  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Applied composite materials 1 (1994), S. 449-463 
    ISSN: 1573-4897
    Keywords: SiC-pure Al composites ; Erosion ; Interfacial reaction ; SEM analysis ; Granulometrical analysis
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract The granulometrical and morphological variations of eroded reinforcement particles during annealing for different times at several temperatures have been studied for SiC-pure Al system. The changes produced have been analysed by scanning electron microscope (SEM) after particle extraction.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Springer
    Rheologica acta 23 (1984), S. 291-296 
    ISSN: 1435-1528
    Keywords: Dynamic properties ; time-temperature superposition ; cure-viscosity ; epoxy resin
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Physics
    Notes: Abstract The change of the viscosity profile during the isothermal cure of a commercially available epoxy system commonly used as a matrix for high performance composites, TGDDM-DDS from CIBA, has been obtained by means of both a constant shear rate viscometer and a dynamic one. The range of temperature investigated varied from 120 up to 180°C. The increase of the molecular weight during the cure reaction is reflected on a macroscopic level in a progressive linear increase of the logarithm of the shear viscosity up to a critical point, near gelation, where an upturn is observed. The values of the time and viscosity at the critical point have been used to normalize the experimental data in a single generalized curve of the cure-viscosity profile. The William, Landel and Ferry equation has been found to adequately describe the temperature dependence of the viscosity for systems in the range of temperatures where the cure reaction did not occur. The apparent activation energy of the cure reaction, 19.7 Kcal/mole, obtained from the critical times, is consistent with calorimetric determinations.
    Type of Medium: Electronic Resource
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