Publication Date:
2019-07-13
Description:
A two part research study has been completed on the topic of compression after impact (CAI) of thin facesheet honeycomb core sandwich panels. The research has focused on both experiments and analysis in an effort to establish and validate a new understanding of the damage tolerance of these materials. Part 2, the subject of the current paper, is focused on the analysis, which corresponds to the CAI testings described in Part 1. Of interest, are sandwich panels, with aerospace applications, which consist of very thin, woven S2-fiberglass (with MTM45-1 epoxy) facesheets adhered to a Nomex honeycomb core. Two sets of materials, which were identical with the exception of the density of the honeycomb core, were tested in Part 1. The results highlighted the need for analysis methods which taken into account multiple failure modes. A finite element model (FEM) is developed here, in Part 2. A commercial implementation of the Multicontinuum Failure Theory (MCT) for progressive failure analysis (PFA) in composite laminates, Helius:MCT, is included in this model. The inclusion of PFA in the present model provided a new, unique ability to account for multiple failure modes. In addition, significant impact damage detail is included in the model. A sensitivity study, used to assess the effect of each damage parameter on overall analysis results, is included in an appendix. Analysis results are compared to the experimental results for each of the 32 CAI sandwich panel specimens tested to failure. The failure of each specimen is predicted using the high-fidelity, physicsbased analysis model developed here, and the results highlight key improvements in the understanding of honeycomb core sandwich panel CAI failure. Finally, a parametric study highlights the strength benefits compared to mass penalty for various core densities.
Keywords:
Composite Materials
Type:
AIAA Paper 2012-1704
,
NF1676L-13332
,
53rd AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference; Apr 23, 2012 - Apr 26, 2012; Honolulu, HI; United States
Format:
application/pdf
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