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  • 1
    Electronic Resource
    Electronic Resource
    Assessment of the adhesive bond properties of allyl 2-cyanoacrylate (1981)
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 26 (1981), S. 1941-1949 
    Details
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The adhesive bond of allyl 2-cyanoacrylate between steel substrates has been analyzed and compared to that of ethyl 2-cyanoacrylate. Mechanical strength as well as thermomechanical, calorimetric, thermogravimetric, and dynamic mechanical response was observed. It was demonstrated that the allyl 2-cyanoacrylate bonds exhibit improved temperature resistance owing to the formation of heat-induced crosslinks in the adhesive layer, resulting in much improved lap-shear strengths. Scanning electron microscopy of the fracture surfaces showed that plastic deformation occurred in the allyl 2-cyanoacrylate adhesive after thermal aging, while interfacial and brittle failure dominated all other cases.
    Additional Material: 9 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/app.1981.070260618
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  • 2
    Electronic Resource
    Electronic Resource
    Solubility of nonpolar and slightly polar organic compounds in low-density polyethylene by inverse gas chromatography with open tubular column (1985)
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 30 (1985), S. 1815-1826 
    Details
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Inverse gas chromatography (IGC) with open tubular column was used to determine low pressure solubilities of 13 organic solutes in low-density polyethylene (LDPE) for temperatures from 50 to 175°C. Based on the principle of corresponding states, two simple correlation equations were developed for estimation of the solubility of nonpolar and slightly polar solutes in rubbery and molten LDPE.
    Additional Material: 2 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/app.1985.070300503
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  • 3
    Electronic Resource
    Electronic Resource
    Effect of metal particle incorporation on adhesive and electrical properties of acetylene-terminated polyisoimide prepolymers (1988)
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 36 (1988), S. 1295-1304 
    Details
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Modification of properties of an addition-curing polyisoimide prepolymer is achieved by the incorporation of small metal particles. No evidence for the modification of the cure chemistry of the prepolymer is observed. Physical modification of the system is observed in electrical, dynamic mechanical, and adhesive properties. Compositions containing various volume fractions of metal and polymer were prepared. Two different molecular weights of prepolymer were studied. Samples were prepared by fabricating single overlap adhesive specimens to aluminum. These lap shear specimens were then used for the electrical and adhesive properties of the material. The electrical properties improved markedly at above 25 volume percent metal loading. The adhesive properties to aluminum showed a maximum at 20-25 volume percent loading. X-ray photoelectron spectroscopy was used to examine adhesive failure surfaces.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/app.1988.070360605
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  • 4
    Electronic Resource
    Electronic Resource
    Accelerated imidization reactions using microwave radiation (1992)
    Bognor Regis [u.a.] : Wiley-Blackwell
    Journal of Polymer Science Part A: Polymer Chemistry 30 (1992), S. 1647-1653 
    Details
    ISSN: 0887-624X
    Keywords: microwave processing ; imidization ; rapid curing ; Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: Microwave radiation has been clearly shown to result in enhancement of the rate of reaction for an imidization reaction. Analysis of the kinetic parameters showed that the apparent activation energy for the reaction was reduced from 105 to 55 kJ/mol, under the conditions of this experiment. The mechanism which has been proposed to explain this enhancement is based on the concept of a nonuniform temperature on a molecular scale, rather than a true reduction in the activation energy. © 1992 John Wiley & Sons, Inc.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pola.1992.080300817
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  • 5
    Electronic Resource
    Electronic Resource
    The dielectric behavior of glassy amorphous polymers at 2.45 GHz (1993)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 33 (1993), S. 1110-1121 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The dielectric behavior of glassy thermoplastic polymer in the microwave frequency range was investigated. Specifically, the relationship between energy absorption and temperature for several thermoplastic systems was examined to test the theoretical basis for heating under microwave irradiation. Irradiation under traveling and standing wave conditions were explored. The heating rate versus temperature data at a frequency of 2.45 GHz yielded a microwave calorimetry procedure for examination of the dielectric and relaxation behaviors. Correlations were drawn between (a) the apparent activation energy and the critical temperature, and (b) the shape of the dielectric spectra at 2.45 GHz and its shape in the kHz region. WLF relationships were examined for glassy thermoplastics to show the difference in changing activation energy with temperature.
    Additional Material: 17 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760331704
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  • 6
    Electronic Resource
    Electronic Resource
    Basic ideas of microwave processing of polymers (1993)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 33 (1993), S. 1092-1109 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The objective of this effort has been to investigate the relationship between polymer structure and microwave absorptivity. Dielectric loss factor, ε″, loss tangent, tan δ, and oscillator strength, (εS -- ε∞), were used to evaluate potential material processability under applied microwave radiation. Numerous polymeric materials varying in chemical and physical structures were irradiated in a low power (≤ 100W) electric field at 2.45 GHz. Electromagnetic radiation was applied as either traveling or resonant wave modes in cylindrical and rectangular waveguides. In general, heatability was found to be a direct function of the dielectric loss dispersion dependence on temperature and frequency. The dielectric loss factor obtained at low frequency measurements was found to be directly proportional to the heatability of polymers. A WLF plot was used to predict the shift of dielectric loss maxima into or out of the microwave frequency range.
    Additional Material: 19 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760331703
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  • 7
    Electronic Resource
    Electronic Resource
    Microwave processing of two-phase systems: Composites and plymer blends (1995)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 35 (1995), S. 144-150 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The objective of the current paper was to extend the relationships between complex polymer structures and microwave absorptivity that were formulated in the first three papers of this series (1-3). The microwave processing of composite and polymeric blends via a cylindrical resonance wave cavity and a rectangular standing wave applicator is described. These polymeric materials were irradiated in a low power (〈 100W) electric field at 2.45 GHz. Graphite-epoxy laminates were processed in both standing and traveling wave applicators. Rapid heating and curing were achieved in both cases. An observation of significance was that, with proper tuning of the traveling wave device (the precursor of a protable repair tool), it proved to be highly effective in processing. Additionally, a compatible blend of poly(methyl methacrylate) and poly(vinylidene fluoride) was heated in and applicator and the rates of temperature rise were demonstrated to depend upon morphology.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760350204
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  • 8
    Electronic Resource
    Electronic Resource
    Temperature and stress effects in the creep of aramid fibers under transient moisture conditions and discussions on the mechanisms (1992)
    Bognor Regis [u.a.] : Wiley-Blackwell
    Journal of Polymer Science Part B: Polymer Physics 30 (1992), S. 1391-1400 
    Details
    ISSN: 0887-6266
    Keywords: creep of aramid fibers, temperature and stress effects ; poly(p-phenylene terephthalamide), mechano-sorptive creep mechanisms ; Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Notes: In a previous study, a mechanosorptive phenomenon in poly(p-phenylene terephthalamide) fibers was reported. In this article, the mechanosorptive creep mechanism of aramid fibers and the temperature and stress influences on the mechanosorptive creep behavior of aramid fibers are addressed. Test results indicate that logarithmic creep rates and the mechanosorptive effects increase with temperature. The creep activation energies of the fibers tested are: 20 kJ/mole for the cyclic moisture condition, 4.4 kJ/mole for a high equilibrium moisture condition (RH = 95%), and 7.8 kJ/mole for a low equilibrium moisture condition (RH = 5%). Increase in stress may increase the logarithmic creep rates but may reduce the mechanosorptive effect. Aramid fibers contain hydrogen bonds between rodlike crystallites oriented at small angles relative to the fiber axis. Transient moisture conditions may cause slippage of hydrogen bonded elements and result in accelerated crystallite rotations due to breakage of hydrogen bonds, thus causing increases in logarithmic creep rate. The obtained activation energies and the reduction in fiber elastic compliance due to creep deformation support the proposed mechanisms. © 1992 John Wiley & Sons, Inc.
    Additional Material: 9 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/polb.1992.090301210
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  • 9
    Electronic Resource
    Electronic Resource
    The role of colloid formation, imidization, and aggregation in the structure of BTDA-ODA polyimide films modified with gold (1988)
    Bognor Regis [u.a.] : Wiley-Blackwell
    Journal of Polymer Science Part B: Polymer Physics 26 (1988), S. 1641-1655 
    Details
    ISSN: 0887-6266
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Notes: High-temperature polyimide films with metallic gold surfaces can be fabricated by the incorporation of a soluble metal salt into a solution of polyamic acid. Thermal treatment of these solutions produces the polyimide, decomposes the metal salt to metallic gold, and promotes the formation and growth of the metallized surface. What appeared to be a continuous metallic surface was actually composed of large gold aggregates. It is suspected that the formation of colloidal gold during the initial thermal treatment provides precursors to the large metal aggregates. Thermal treatment has been shown to influence the size and distribution of the aggregates. The shape of the aggregates suggests that diffusion-limited aggregation may be responsible for the unique shape of some of the gold aggregates.
    Additional Material: 12 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/polb.1988.090260807
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  • 10
    Electronic Resource
    Electronic Resource
    Characterization of epoxy-surfactant interactions (1998)
    Bognor Regis [u.a.] : Wiley-Blackwell
    Journal of Polymer Science Part B: Polymer Physics 36 (1998), S. 2781-2792 
    Details
    ISSN: 0887-6266
    Keywords: waterborne epoxy ; surfactant ; cooperativity ; Fox equation ; Physics ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Notes: We have investigated epoxies based on the diglycidyl ether of bisphenol A (DGEBA) cured with 2-ethyl-4-methylimidazole (EMI-24) in the presence of the nonionic surfactant Triton X-100. A goal was to determine if the viscoelastic properties of the epoxy-surfactant system differed when prepared in bulk form, as opposed to being cast as a thin film on the surface of E-glass cloth. Such a combination of materials has generated great interest for potential use in the construction of laminated circuit boards. Using dynamic mechanical analysis (DMA), differential scanning calorimetry (DSC), transmission electron microscopy (TEM), and atomic force microscopy (AFM), it was determined that the surfactant acts as a plasticizer and is miscible with the epoxy system in concentrations up to 15% by weight. The glass transition temperature (Tg) depression of the epoxy due to the surfactant was accurately described by the Fox equation. DMA master curves were constructed in the frequency domain. The temperature dependence of the shift factors was used to determine the fragility of each of the samples studied. It was found that the fragility (cooperativity) of the epoxy decreased as the concentration of surfactant increased, presumably due to a reduction of intermolecular constraints. The fragility of the combined epoxy-surfactant system increased when cast on the surface of the E-glass cloth. Results for our model epoxy-surfactant resin were in excellent agreement with those obtained using a commercially available aqueous waterborne epoxy resin. © 1998 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 36: 2781-2792, 1998
    Additional Material: 12 Ill.
    Type of Medium: Electronic Resource
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