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  • 1
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 32 (1992), S. 678-685 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Using the technique of photoelasticity, we have studied in detail the magnitude of the residual microstress at the matrix interface between epoxy resin and rubber particles or glass beads. A spheric stress-optic equation applicable to these composites was derived. The photoelastic figures induced by the interfacial residual microstresses and the factors affecting the intensity of light are discussed. The experimental results show that the residual microstresses at the matrix interface are independent of the particle size of rubbers or glass beads, but depend on the nature of fillers, which have different thermal expansion coefficients and mechanical properties. Thermal history and interfacial chemical bonding of filled epoxy resins have distinct effects on the residual interfacial microstresses and the matrix internal stresses.
    Additional Material: 10 Ill.
    Type of Medium: Electronic Resource
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