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  • 1
    Electronic Resource
    Electronic Resource
    Plasma and surface modeling of the deposition of hydrogenated carbon films from low-pressure methane plasmas (1993)
    Springer
    Applied physics 56 (1993), S. 527-546 
    Details
    ISSN: 1432-0630
    Keywords: 52.25.Dg ; 79.20.Nc ; 82.65.Yh
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Abstract The elementary mechanisms are described which determine the plasma and surface processes during the plasma-enhanced chemical vapour deposition of hydrogenated carbon films from methane. Corresponding model calculations are reviewed and critically discussed in comparison to experimental results. A realistic modeling requires the simultaneous and self-consistent treatment of plasma and surface effects. Several experimental data sets on plasma parameters and the growth and the composition of the films have been reproduced successfully. However, a broader experimental data base is needed for more critical tests of the models. The reliability of the modeling, in particular of the surface effects, is still limited due to the poor availability of elementary data.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF00331402
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  • 2
    Electronic Resource
    Electronic Resource
    Hermetische Mikroelektronik-Verkapselungen in der Luft- und Raumfahrt zur Vermeidung von Korrosion (1993)
    Weinheim [u.a.] : Wiley-Blackwell
    Materials and Corrosion/Werkstoffe und Korrosion 44 (1993), S. 124-129 
    Details
    ISSN: 0947-5117
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Description / Table of Contents: Corrosion-resistant, hermetic microelectronic packages for aerospace applicationsCorrosion-resistant, high reliable aerospace electronics need expensive ceramic substrates, noble metal conductors and very clean stainless steel or ceramic packages. The requirements, material technologies, problems and more economical packages are described.
    Notes: Zur Vermeidung von Korrosionsschäden an Sicherheitselektroniken der Luft- und Raumfahrt sowie der Wehrtechnik werden vorzugsweise Keramik-Substrate und Edelmetall-Leiter sowie völlig feuchte- und salzfreie, hermetisch verschlossene Metall oder Keramikgehäuse verwendet. Die Anforderungen, Materialien, Technologien und Probleme der hermetischen Mikroelektronik-Verpackung wird im folgenden Aufsatz näher beschrieben werden.
    Additional Material: 6 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/maco.19930440404
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